Packaging Research and Development Engineer

Intel Corporation•Chandler, AZ

8d•$133,800 - $188,890•Onsite

About The Position

Intel's Substrate Packaging Technology Development (SPTD) organization is seeking a talented and driven Packaging Research and Development Engineer to join our Module Engineering Backend team in Chandler, Arizona. This is a rare and exciting opportunity to be part of a world-class, first-of-its-kind embedded die packaging facility — a team that is literally writing the history books of the substrate packaging industry. In this role, you will be at the forefront of developing and scaling advanced substrate packaging technologies that enable die disaggregation and heterogeneous integration — two of the most critical frontiers in modern semiconductor engineering. You will spend the majority of your time on the factory floor, working hands-on with cutting-edge equipment and materials, collaborating with world-class engineers, and engaging directly with equipment and material suppliers to push the boundaries of what's possible. If you are passionate about materials science, process engineering, and disruptive technology innovation — and you want your work to have a real, lasting impact on the future of computing — this is the role for you.

Requirements

PhD degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a closely related field.
1+ years of relevant experience in a science or engineering field (obtained through academic research, internships, or professional experience).
Communicates clearly and confidently — both in writing and verbally — and thrives in a collaborative team environment.
Is naturally curious and driven to solve complex, ambiguous problems with creativity and persistence.
Adapts easily to evolving priorities and is comfortable working with a degree of ambiguity and flexibility.
Builds strong, productive relationships with colleagues, suppliers, and cross-functional partners.
Takes ownership and accountability for your work, and brings a proactive, solutions-oriented mindset to every challenge.
Is open to occasional travel (less than 5%) to engage with suppliers and partners.

Nice To Haves

1+ years of experience in: Engineering troubleshooting and analytical problem-solving on integrated technology challenges, working within broad, cross-functional engineering teams.
Owning and operating process tools, with knowledge of Statistical Process Control (SPC), Process Change Systems (PCS), Request for Change (RFC) processes, equipment troubleshooting, statistical design of experiments, and process development.
Variety of organic and inorganic materials and processes, including characterization techniques such as DSC, TGA, D/TMA, Titration, ICP-MS, FTIR, XPS, TOF-SIMS, EDX, and SEM.
Statistical data analysis tools including JMP, JSL, and Python; familiarity with relational database structures and machine learning concepts.

Responsibilities

Define and establish equipment configurations, process specifications, and integrated process flows for new and emerging packaging technologies.
Plan and conduct comprehensive Design of Experiments (DOEs) to fundamentally characterize process windows and understand the complex interactions between processes, equipment, and materials.
Drive continuous improvements in process capability and stability, quality and reliability, cost and yield, automation, and overall productivity.
Lead and actively participate in cross-functional and cross-organizational teams and working groups that support substrate technology development.
Engage and collaborate with equipment and materials suppliers to evaluate, qualify, and optimize new technologies and solutions.
Apply advanced analytical and characterization techniques to evaluate organic and inorganic materials and processes.
Leverage statistical data analysis tools and programming skills to derive actionable insights from complex datasets.