Packaging Module Development Engineer

Intel Corporation•Chandler, AZ

6d•$133,800 - $219,550•Onsite

About The Position

Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Applies engineering principles and novel concepts to deliver innovative solutions that improve process control, product quality, reliability, productivity, yield, and manufacturability. Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Applies principles of Design of Experiments (DOE), statistical analysis, and Measurement System Analysis (MSA) to ensure robust process capability and consistency across tools, sites, and product generations. Documents technical innovations and improvements through white papers, qualification summaries, and technical reports. Develops and maintains equipment and measurement systems to evaluate silicon and package technologies under simulated field-use conditions—including heat, humidity, temperature cycling, and dynamic forces—to ensure early identification of potential problems with packaging quality and reliability. Oversees the manufacturability of physical package layouts and the overall cycle of manufactured processes, procedures, and flows. Sets reliability and metrology requirements to meet customer needs and influences design, material selection, and process development based on a fundamental understanding of failure mechanisms. Establishes material and measurement specifications for vendors, contract assemblers, and internal teams. Interfaces with supplier quality, procurement, and partner engineering groups to ensure material quality and vendor performance meet strict adherence to process specifications and product qualification methods. Develops new techniques, acceleration methods, and quality screens to identify risk areas early in the development cycle. Leads efforts in innovation and problem-solving to continuously improve equipment and processes using experimental design and statistical methods. Provides technical consultation on packaging challenges, measurement discrepancies, and process improvements, responding to customer or client requests as they occur. Provides technical consultation on packaging challenges, measurement discrepancies, and process improvements, responding to customer or client requests as they occur. Delivers standardization in product qualification, manufacturing quality systems, and metrology methods. Continuously engages with packaging technology development and partner engineering groups on process and technology maturity to mitigate key risk areas and meet critical product milestones.

Requirements

Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related STEM field with 3+ years of industry experience -OR- PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related STEM field with 1+ years of industry experience
Minimum cumulative GPA of 3.5.
Must have the required degree prior to your start date.
Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE), preferably within semiconductor or advanced manufacturing environments.
Strong experimental background, including hands-on laboratory or prototype development experience.
Experience in programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts

Responsibilities

Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
Applies engineering principles and novel concepts to deliver innovative solutions that improve process control, product quality, reliability, productivity, yield, and manufacturability.
Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
Applies principles of Design of Experiments (DOE), statistical analysis, and Measurement System Analysis (MSA) to ensure robust process capability and consistency across tools, sites, and product generations.
Documents technical innovations and improvements through white papers, qualification summaries, and technical reports.
Develops and maintains equipment and measurement systems to evaluate silicon and package technologies under simulated field-use conditions—including heat, humidity, temperature cycling, and dynamic forces—to ensure early identification of potential problems with packaging quality and reliability.
Oversees the manufacturability of physical package layouts and the overall cycle of manufactured processes, procedures, and flows.
Sets reliability and metrology requirements to meet customer needs and influences design, material selection, and process development based on a fundamental understanding of failure mechanisms.
Establishes material and measurement specifications for vendors, contract assemblers, and internal teams.
Interfaces with supplier quality, procurement, and partner engineering groups to ensure material quality and vendor performance meet strict adherence to process specifications and product qualification methods.
Develops new techniques, acceleration methods, and quality screens to identify risk areas early in the development cycle.
Leads efforts in innovation and problem-solving to continuously improve equipment and processes using experimental design and statistical methods.
Provides technical consultation on packaging challenges, measurement discrepancies, and process improvements, responding to customer or client requests as they occur.
Delivers standardization in product qualification, manufacturing quality systems, and metrology methods.
Continuously engages with packaging technology development and partner engineering groups on process and technology maturity to mitigate key risk areas and meet critical product milestones.