Packaging Integration Engineer

GlobalFoundries•Essex, VT

1d•$143,000 - $247,000

About The Position

As a Packaging Engineer within GF’s Integrated Optics organization, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures that meet stringent performance and reliability targets.

Requirements

Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, Optical Engineering or related field.
8+ years of experience in semiconductor packaging, with a focus on photonic or advanced packaging.
Hands-on experience with fiber attach processes, photonic alignment, and optical coupling techniques.
Familiarity with packaging technologies such as die attach, flip-chip, underfill, molding, and micro-optics integration.
Understanding of reliability standards and qualification methodologies for optical modules.
Excellent analytical, problem-solving, and communication skills.
Experience in bringing packaged products from development into production.
Strong written and spoken English communication skills.

Nice To Haves

Experience with automated optical/electro-optical test setups and motion control systems (e.g., Python-based).
Knowledge of co-packaged optics (CPO), pluggable modules, and silicon photonics ecosystems.
Expertise in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging.
Strong background in thermal/mechanical modeling and optical simulation tools (e.g., Lumerical, COMSOL).
Familiarity with GF’s Fotonix™ platform, including 300mm monolithic SiPh integration and advanced packaging flows.
Experience working with OSATs and managing external development partners.
Demonstrated ability to lead cross-functional teams and influence technical direction.

Responsibilities

Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.
Develop and implement scalable fiber-to-chip coupling strategies (e.g., V-groove, passive alignment, lens integration) for high-density optical I/O.
Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu hybrid bonding, advanced molded integration).
Perform multiphysics simulations (thermal, mechanical, optical) to optimize package performance and reliability.
Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools.
Collaborate with OSATs and internal manufacturing teams to ensure mass production readiness and process transfer.
Support cost modeling and drive package cost reduction initiatives aligned with GF’s B2B supply chain strategy.
Present technical updates and roadmaps to internal stakeholders and external partners.
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
Travel up to 25% to other GlobalFoundries facilities or external partner sites may be necessary.