Packaging Engineering Intern - Winter

Fab2 • Austin, TX

72d • Onsite

About The Position

About fab2 The fab2 team can build anything. We design all the hardware and software needed to make chips and we make the fabs, tools, and components ourselves. We're looking for exceptional, hands-on people who can iterate to the limits of what's possible. fab2 was founded by Sam Zeloof and Jim Keller . Sam is best known for making chips in his garage, and Jim has been a leader in the semiconductor industry for the past 40 years. About the Role We’re hiring Semiconductor Packaging Engineering Interns for the winter term. The internship begins in January, with a preferred commitment of 4 to 8 months. We are a small team engaged in end-to-end process development and integration work for semiconductor packaging processes, providing exposure to interesting work that is hard to find at larger companies. This is a hands-on engineering role—meaning you will be actively involved in the research and development of new packaging technologies, including mechanical prototyping, experiment design, and data analysis. We train our interns on most of our tools and allow them to use these tools independently, including 3d printing, metal plating, lasering, and metrology. Our philosophy is to get things built and tested in days or weeks, not months. Because of this, a portfolio is required to apply : show us the things you’ve actually built! If you’ve shipped a medium-to-high complexity system through a personal project or previous internship, you’d be a good fit here.

Requirements

• Pursuing a Bachelor’s Degree or higher in engineering
• At least 1-2 hands-on wet lab or lab-adjacent experiences, ideally in metal plating work or fabricating devices
• Strong foundation in mechanical engineering (Solidworks/Onshape, materials selection, etc.)
• Hands-on prototyping experience and the ability to move through design cycles quickly

Nice To Haves

• Proven experience in mechatronics or electromechanical system design
• Familiarity with lasering and 3D printing (stereolithography)
• Reliability testing, soldering, and reflow testing
• Hands-on experience with nano-fabrication tools (etching, deposition, patterning) and metrology tools (SEM, thin film measurement, X-ray, etc.)

Responsibilities

• Design and iterate on machines and subsystems for semiconductor packaging fabrication, such as laser ablation machines, reflow ovens, and automated metal plating facilities
• Integrate mechanical, electrical, and optical components in system assembly, including wiring, optics alignment, and electronics
• Collaborate with cross-functional teams to continuously improve fabrication processes and equipment
• Hands-on package/wafer processing (3d printing, metal plating, lithography, metrology)

Benefits

• Housing Stipend to help with first month expenses
• Lunches daily, Dinners 3x per week, Stocked Office Kitchen with Snacks and Spindrifts
• Weekly Learning & Development opportunities
• Commuter Benefits including Parking and Late Night Uber rides from the office
• Paid Time Off inclusive of Holidays and Sick Time
• Visa Sponsorship
• Medical, Dental, and Vision insurance
• 401(k) retirement plan
• Life and Disability Insurance

What This Job Offers

• Job Type: Full-time
• Career Level: Intern