Packaging Engineering Intern MS/PhD
About The Position
Interface across various work areas and organizations to help with the design, development, and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products. Assignments may include participation in cross-functional teams to develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness. Cultivate packaging advancements with work in material, mechanical, thermal, and electrical characterization. TI's innovative packaging technologies are designed to solve customers' problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power.
Requirements
- Currently pursuing an MS or PhD degree.
Responsibilities
- Help with the design, development, and analysis of different semiconductor packaging technologies.
- Participate in cross-functional teams to develop internal and external solutions for semiconductor packaging technologies.
- Cultivate packaging advancements with work in material, mechanical, thermal, and electrical characterization.
Benefits
- Competitive pay and benefits designed to help you and your family live your best life.
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What This Job Offers
Career Level
Intern
