Packaging Engineer

Analog Devices•San Jose, CA

46d•Onsite

About The Position

We are looking for a highly motivated Packaging Engineer who will drive IC package and module development activities for ADI’s new and existing products. This position will be based in San Jose, CA. IC package design: design and optimize IC packages for a wide range of ADI products, using common and advanced analog IC package platforms and assembly/bumping processes. Power module and system design: design and optimize power modules for performance, manufacturing, and reliability. Design automation: responsible for package-level, module-level, and system-level design automation. Assembly subcontractor/OSAT management: work closely with ADI’s oversea assembly subcontractor/OSATs for new package development and other package-related engineering activities. Late afternoon/early evening conference calls are expected. Cross functional team collaborations: work closely with internal reliability team, business units, and supply chain management team to provide package engineering support. Project management: plan and drive package development projects.

Requirements

Bachelor’s degree in Materials Science and Engineering, Applied Physics, Electrical Engineering, Mechanical Engineering, or Computer Science is required.
Knowledge and experience in analog IC package and module design, optimization, and manufacturing.
Knowledge and experience in selecting IC package bill of material (BOM): solid understanding of mechanical, thermal, and electrical properties of materials, including semiconductors, metals, ceramics, and polymer composites.
Solid skills/experience in CAD tools are desired to create package design models and drawings for package development, simulation, and documentation.
Experienced in Python, machine learning, and image analysis.
Experienced in data analysis.

Nice To Haves

Master’s degree is preferred.
Internship experience in semiconductor industry is preferred.
Package-level and system-level thermal/mechanical/electrical/magnetic simulation skill is a plus.

Responsibilities

Design and optimize IC packages for a wide range of ADI products, using common and advanced analog IC package platforms and assembly/bumping processes.
Design and optimize power modules for performance, manufacturing, and reliability.
Responsible for package-level, module-level, and system-level design automation.
Work closely with ADI’s oversea assembly subcontractor/OSATs for new package development and other package-related engineering activities.
Work closely with internal reliability team, business units, and supply chain management team to provide package engineering support.
Plan and drive package development projects.