Career Accelerator Program - Packaging Engineer - PhD

Texas Instruments

19h

About The Position

Texas Instruments' Career Accelerator Program (CAP) provides first-year professional and technical training, resources, function-specific technical training, and on-the-job learning to accelerate new employees' integration and support long-term career success. The TMG Development Program is a 12-month program for new college graduates in the TMG organization.

The Packaging Engineer works across work areas and organizations to help design, develop, and analyze semiconductor packaging technologies for TI's analog and embedded processing products. The role supports packaging solutions at different stages of readiness, including technologies intended to improve miniaturization, integration, reliability, performance, and power consumption. The position is in a fast-paced, dynamic environment requiring prioritization and adaptability, with opportunities to collaborate with a global team.

Requirements

• PhD in Material Science, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a related field.
• Cumulative GPA of 3.0/4.0 or higher.

Nice To Haves

• Coursework or research in semiconductor packaging or fabrication.
• Experience with AutoCAD design and FEM modeling.
• Strong fundamentals in heat transfer, thermodynamics, and stress analysis.
• Experience with Semiconductor MEMS/3D integration design and fabrication.
• Project experience in CVD, PVD, thin film deposition, electroplating, plasma etch, ML-based package design, wafer bumping, or optical packaging.
• Experience with plating, adhesion, or surface treatment processes.
• Hands-on experience with semiconductor fabrication and characterization tools, including VI Scopes, X-ray inspection, materials characterization, and failure analysis techniques.
• Strong written and verbal communication skills.
• Demonstrated analytical and problem-solving skills.
• Ability to work in teams and collaborate effectively with people in different functions.
• Strong time management skills that enable on-time project delivery.
• Ability to build strong, influential relationships.
• Ability to work effectively in a fast-paced and rapidly changing environment.
• Ability to take initiative and drive results.

Responsibilities

• Partner with business teams to design and develop internal and external semiconductor packaging solutions, including Wirebond, Flip Chip, Modules, SIPs, and other advanced packages.
• Participate in cross-functional teams supporting product qualification and production, reliability and yield requirements, design testability, and test coverage.
• Direct design-of-experiments and work with material suppliers to select innovative packaging materials that enhance advanced-package reliability and performance.
• Conduct electrical, mechanical, and thermal modeling to understand silicon-to-package interaction, establish design rules, and predict and prevent high-risk designs.

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level
• Education Level: Ph.D. or professional degree