Packaging Engineer Intern

MACOM Technology Solutions Holdings, Inc. • Milpitas, CA

3d • $20 - $47

About The Position

MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks.

MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers’ success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates.

Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure!

Requirements

• Student in Mechanical / Thermal Engineering
• Working knowledge of Autocad / Solidworks
• Working knowledge of FEA tools (ANSYS/Icepak / Flotherm)

Nice To Haves

• Be given an individual and well-defined project with set outcome goals
• Gain hands on experience
• Receive excellent training and ongoing supervision
• Be invited to attend an intern webinar series
• Attend networking/social events
• Attend and present at Poster Session about each Interns project successes and pitfalls

Responsibilities

• Assist the Packaging Engineer to perform several of the job functions required to package bumped IC to adhere to customer specifications and meet reliability and manufacturing specifications
• Bump Mask Design
• Substrate Design
• Thermal Analysis
• Perform design reviews to ensure adherence to manufacturing guidelines

Benefits

• The Hourly Range for this position is $20 – $47 per hour. Actual salary offered to candidate will depend on several factors, including but not limited to, work location, relevant candidates’ experience, education, and specific knowledge, skills, and abilities.

What This Job Offers

• Career Level: Intern
• Education Level: No Education Listed