Package Failure Analysis Engineer

Intel•Chandler, AZ

10d•Onsite

About The Position

This role will support root cause determination of assembled package yield loss and in-line failures on a back of week compressed shift. The engineer on shift will be responsible for technical functions such as design, test, checkout, modifications, and characterization of assembly technologies. Engineers on back/front of week shift schedules will help bridge support between shift engineering technicians, as well as shift 1 engineers and module partners, yield support, integration and program customers in a collaborative environment. As part of this role, the engineer will help align program priorities, share and provide technical expertise regarding analysis results, and ensure an inclusive work environment. Engineers can expect to work collaboratively with additional engineers and engineering technicians to conduct analyses and engineering tests to accomplish fault isolation of electrical failures and perform defect and/or process characterization in support of identifying key mechanisms that contribute to RC identification.

Requirements

Must possess a bachelor's degree or higher in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or Chemistry and Physics or related field.
US Citizenship is required.
Ability to obtain and maintain a US Government TS/SCI Security Clearance with Polygraph.
Hands-on experience with 1 or more electrical fault isolation or defect characterization techniques.
Ability to communicate findings verbally and through reports to yield engineers, LYA analysts, and other customers.
Ability to work in a collaborative manner with a variety of different individuals in a fast paced, technical environment.
Ability to work effectively in an ambiguous environment where changing priorities and the norm.

Nice To Haves

Active US Government TS/SCI Security Clearance with Polygraph.
Prior experience working in a lab environment or with lab equipment in academic setting.
Experience including labs or coursework pertaining to optical analysis techniques such as SEM, TEM, x-ray, and optical microscopy.
Experience including labs or coursework providing fundamental understanding of electrical circuits. This could include circuits and electronics courses, labs, and hands-on experience with multimeters and other probing equipment including any specialized equipment such as: TDR, EOTPR, EBAC, RIDR, and/or ELITE.
Experience including labs or coursework with chemical compositional analysis techniques such as EDX. AFM, FTIR, Raman, and diffraction techniques such as XRD and EBSD.
Familiarity with CAD software and basic statistical analysis tools such as JMP are a plus.

Responsibilities

Working across team boundaries to achieve strategic objectives and meet program deliverables.
Understand and support program milestones and schedules.
Interface with a wide variety of internal teams to improve yield and drive innovation.
Conduct hands-on lab work, define data acquisition strategy and data analysis plan, and recommend corrective actions and/or fixes to internal customers.
Develop failure analysis innovative techniques, BKMs, and/or approaches to accelerate failure identification and mechanism understanding.
Provide consultation concerning packaging and/or assembly problems and improvements in the manufacturing process.
Respond to customers' requests or events as they occur.
Work with ambiguity and flexibility with respect to job roles and working hours, have strong analytical and problem-solving skills, and possess robust communication and presentation skills.