Package Design Methodology Engineer

NVIDIA•Austin, CA

About The Position

NVIDIA's Advanced Package Engineering team is expanding and is at the intersection of chip design and the physical reality of getting silicon to product. As AI systems grow more complex, NVIDIA's multi-die packages have become some of the most challenging engineered products, connecting dozens of chiplets across substrates, interposers, and heterogeneous interfaces. The engineers who build the automation infrastructure for these packages don't just write software — they directly determine whether NVIDIA can tape out on schedule and at scale. This role is a rare opportunity to craft production-grade EDA tooling that operates at the bleeding edge of packaging technology, where no commercial solution exists yet and the problems you solve become the new industry baseline. This is the job for you if you want to develop design flows for NVIDIA's next-generation AI and HPC platform packages.

Requirements

BS in Computer Science, Electrical Engineering, or a related field (or equivalent experience), and 5+ years of flow and methodology development experience building flows for package design used by engineering teams at scale.
Good programming fundamentals in Python and/or C++, including proficiency with data structures, algorithms, object-oriented design, and code quality practices.
Demonstrated experience applying AI/ML techniques in engineering workflows — this could include using LLMs for code generation and debugging, building ML-assisted design analysis tools, or integrating AI-assisted flows into EDA environments.
Strong understanding of electrical engineering fundamentals relevant to VLSI package design (signal integrity, power delivery, parasitic extraction, or equivalent).

Nice To Haves

Good understanding of VLSI package design along with interposer and IC physical design.
Strong expertise in developing package design flows and methodologies.

Responsibilities

Work with world-class engineers to design and implement VLSI tools for silicon and substrate design.
Develop applications to enable project engineers with an emphasis on maintainability and ease of use.
Develop flows/tools and methodologies to construct, analyze, and validate package designs at many different stages in the production flow.
Optimize the daily workflows of the world's top package designers.