About The Position

KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. KLA invents systems and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. The innovative ideas and devices that are advancing humanity all begin with inspiration, research and development. KLA focuses more than average on innovation and we invest 15% of sales back into R&D. Our expert teams of physicists, engineers, data scientists and problem-solvers work together with the world’s leading technology providers to accelerate the delivery of tomorrow’s electronic devices. Life here is exciting and our teams thrive on tackling really hard problems. There is never a dull moment with us. The Broadband Plasma Division (BBP) provides market-leading patterned wafer optical inspection systems for leading-edge IC manufacturing. Logic, foundry, and memory customers depend on BBP products to detect yield-critical defects for process debug and excursion monitoring at advanced process nodes. BBP flagship products include the 29xx and 39xx series which leverage Broadband Plasma technology to capture a wide range of defects with ultimate sensitivity at the optical inspection speeds needed for inline defect monitoring.

Requirements

  • Doctorate (Academic) or work experience of 0 years
  • Master's Level Degree or work experience of 2 years
  • Bachelor's Level Degree or work experience of 3 years
  • CAD Modeling: Cero experience preferred
  • Precision mechanism development: actuator selection, tolerance analysis, lifetime evaluation, optics mounting, alignment & adjustment design, etc
  • CAE: thermal & structural simulation, flow analysis is a plus (ANSYS experience preferred)

Responsibilities

  • Design, build, prototype testing the next generation broad band plasma (BBP) Wafer inspection opto-mechanical assemblies.
  • Collaborated development with core suppliers.
  • Sustain current broad band plasma (BBP) product lines with manufacturing division.
  • Work with system, optical, electrical and software engineer to derive the subsystem requirements and conduct design reviews.
  • Qualify and release the mechanism design, provide support for onsite manufacturing.

Benefits

  • medical
  • dental
  • vision
  • life
  • 401(K) including company matching
  • employee stock purchase program (ESPP)
  • student debt assistance
  • tuition reimbursement program
  • development and career growth opportunities and programs
  • financial planning benefits
  • wellness benefits including an employee assistance program (EAP)
  • paid time off
  • paid company holidays
  • family care and bonding leave
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