New Product Introduction Engineer - Thermal

Nexthop Systems Inc•Santa Clara, CA

2d•Onsite

About The Position

At Nexthop AI, our thermal solutions are as complex as the silicon they cool. We are looking for a Hardware Product Engineer to act as the ultimate technical authority for our Direct-to-Chip (D2C) and rack-level cooling systems. This role sits within the Hardware Design Ladder and is responsible for the physical realization of our hardware—from the initial equipment selection at the factory to the final data sign-off before a product reaches the customer.

Requirements

8+ years in Hardware Engineering, Mechanical Engineering, or Thermal Reliability with a focus on NPI.
Proven experience in determining, qualifying, and buying off high-precision manufacturing equipment for liquid-cooled or high-power electronics.
Experience holding "Ship/No-Ship" authority in a high-stakes hardware environment.
Expert understanding of Direct-to-Chip cooling (Cold plates, Manifolds, QDs) and the mechanics of Thermal Interface Materials.
BS/MS in Mechanical Engineering, Thermal Science, or a related field.

Responsibilities

Drive our thermal solutions vendor portfolio by auditing, assessing, qualifying, and ramping each vendor and their commodity.
Use technical expertise to know when a second source is critical and drive the qualification of that second source.
Research and determine and design the mandatory equipment list required to support NUDD (New, Unique, Different, Difficult) thermal designs (e.g., high-vacuum leak testers, precision TIM dispensers, robotic manifold assemblers).
Lead Factory Acceptance Testing (FAT) and Site Acceptance Testing (SAT). You own the "Buyoff" process, ensuring equipment meets precision, repeatability, and safety standards.
Identify and establish the "North Star" metrics for D2C and rack-level integration. Define what we measure, how it’s captured at the factory, and why it ensures long-term survival.
Lead technical reviews for EVT/DVT/PVT milestones, ensuring all thermal exit criteria are met and documented.
Design thermal test vehicles, assembly fixtures, Thermal Interface Material (TIM) application processes and equipment, ensuring our contract manufacturers have the right equipment to gather the data you require.
Lead the technical deployment of Direct-to-Chip cooling. You own the mechanical interface between the ASIC and the cold plate, ensuring the "physics of the contact" is repeatable across multiple PCBA projects.
Define the technical requirements for integrating switch chassis into liquid-cooled racks, focusing on manifold reliability and blind-mate coupling integrity.
Define and validate Thermal Interface Material (TIM) application and compression standards to prevent pump-out and ensure decade-long thermal stability.
Evaluate and vet emerging cooling technologies—such as two-phase systems or advanced heat siphons—to determine technical and operational fit.
Design and execute long-term reliability plans for cold plates, heatsinks, and fans, including Accelerated Life Testing (ALT), thermal shock, and vibration profiles tailored for high-density AI environments.
Ensure all thermal and hydraulic systems meet industry-leading reliability requirements (referencing relevant ASHRAE or ASTM protocols for liquid-cooled hardware).
Monitor and mitigate thermomechanical stress, ensuring mounting forces on high-cost ASICs remain within specification throughout the product lifecycle.