New College Grad - Mixed Signal Design Engineer, HBM

Micron Technology • Richardson, TX

12d

About The Position

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Micron’s Memory Systems Engineering team and contribute to the development of premier digital and mixed-signal foundations for our high-bandwidth memory (HBM) products. This position offers an outstanding chance to work intimately with multiple engineering areas, guaranteeing the smooth integration and implementation of HBM base die. Join a motivated team committed to delivering robust first-pass silicon that meets strict bandwidth, latency, power, and reliability objectives.

Requirements

• Bachelor’s degree or equivalent experience in Electrical Engineering or Computer Engineering.
• Experience with digital design or SoC integration through academic projects, internships, or early-career industry roles.
• Knowledge of SystemVerilog RTL development, clock/reset architecture, CDC/RDC methodologies, and low-power design concepts.
• Understanding of design-for-debug and design-for-test principles and ability to collaborate with multi-functional engineering teams.
• Experience working in environments that are AI Assisted or AI Enabled, or willingness to harness AI tools to support engineering productivity, debug workflows, and data-driven analysis.

Nice To Haves

• Exposure to post-silicon validation, silicon bring-up, or structured debug workflows.
• Familiarity with scan, MBIST, LBIST, or related test and debug features.
• Experience contributing to verification plans and partnering with design verification teams to achieve coverage goals.
• Interest in refining micro-architecture to improve timing and understanding design tradeoffs related to constraints and path intent.
• Experience Applying AI or Employing AI for data analysis, debug automation, or performance optimization in semiconductor design environments.

Responsibilities

• Define and implement digital micro-architecture for HBM base-die subsystems, including channel support logic, boot and initialization sequencing, training orchestration, configuration/status registers, telemetry, performance counters, and reliability features.
• Translate system requirements into timing, power, and area considerations by partnering with physical layer and system architects; maintain interface specifications for bus protocols, clock-domain crossings, and reset strategies.
• Develop and integrate synthesizable SystemVerilog RTL, including multi-channel logic, interrupts, register maps, scan hooks, and design-for-test interfaces, while supporting integration and ECO flows.
• Collaborate with design verification teams on verification planning, coverage goals, CDC/RDC checks, and debugging of RTL, testbench, and gate-level issues.
• Support silicon bring-up and post-silicon validation through debug enablement, root cause analysis, and collaboration with DFT and test teams.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level