NAND Product Development Engineer

Solidigm•Rancho Cordova, CA

About The Position

Join a multibillion-dollar global company that brings together amazing technology, people, and operational scale to become a powerhouse in the memory industry. Headquartered in Rancho Cordova, California, Solidigm combines elements of an established, successful technology company with the spirit, agility, and entrepreneurial mindset of a start-up. In addition to the U.S. headquarters and other facilities in the U.S., the company has international presence in Asia, Europe, and the Americas. Solidigm will continue to lead the world in innovating new Memory technologies with aspirations to be the #1 NAND memory company in the world. At Solidigm, we view problems as opportunities to define innovative solutions that hold the power to change the world and unleash the potential technological needs that the future holds. At Solidigm, we are One Team that fosters a diverse, equitable, and inclusive culture that embraces individual uniqueness and empowers us to bring our best selves to deliver excellence in support of Solidigm's vision and mission to be the go-to partner for optimized data storage solutions. You can be part of the takeoff of an innovative business that develops cutting-edge products, delivers strong business value for customers, provides an engaging workplace for its employees, and serves a greater impact on the world. This is a golden opportunity for the right applicant to join us and help design, build, and lead Solidigm. We want a diverse team of dedicated professionals who will not just be Solidigm team members but contribute to how we shape the future of the organization. We are seeking applicants who will grow and thrive in our culture; be customer inspired, trusting, innovative, team-oriented, inclusive, results driven, collaborative, passionate, and flexible.

Requirements

Master's degree in Electrical/Electronic Engineering, Computer Engineering, Semiconductor Circuits, or related fields.
5+ years of experience in NAND, memory product engineering, test engineering, or reliability engineering.
Strong knowledge of statistical data analysis, electrical failure analysis, and semiconductor test methodologies.
Demonstrated technical leadership and ability to lead cross-functional projects and mentor engineers.
Strong communication, collaboration, and problem-solving skills.

Nice To Haves

Experience with NAND Flash architecture, burn-in screening, high-speed I/O testing, and manufacturing test optimization preferred.

Responsibilities

Lead the development and optimization of burn-in, reliability screening, and high-speed I/O test methodologies for NAND Flash products.
Drive electrical validation, test coverage improvement, yield enhancement, and test cost reduction initiatives across NAND products.
Lead root cause investigations of complex test and product failures through statistical analysis, electrical failure analysis, and cross-functional collaboration.
Provide technical leadership for new product introduction (NPI), test program development, qualification, and manufacturing ramp.
Lead cross-functional projects involving Design, Process, Reliability, Manufacturing, OSAT, and SSD engineering teams.
Mentor and guide junior engineers on test methodology development, failure analysis, data interpretation, and technical problem solving.
Define and drive backend test roadmap initiatives, including test time reduction, screening optimization, and next-generation test technology deployment.
Work closely with SSD engineering teams to enable NAND component and SSD system co-optimization for quality and reliability improvements.