MTS Process Integration Engineer | APTD Die Level Technology

Micron Technology • Boise, ID

5d

About The Position

The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions.

Requirements

• Bachelor’s degree in Materials Engineering, Chemical Engineering, or a related field with 8+ years of experience to include advanced packaging technology development, 2.5D, 3D stacking, and HBM integration
• Experience with TSVs, advanced interconnects, die stacking, underfill, molding, bonding, and package integration processes
• Experience with hybrid bonding integration and reliability, including wafer-to-wafer or chip-to-wafer processes
• Experience with HBM and logic integration, including thermal optimization
• Experience supporting cross-functional engineering programs in a fast-paced development environment

Nice To Haves

• Master’s degree or PhD in Materials Engineering, Chemical Engineering, or a related field
• Experience developing thermocompression bonding, microbump, or interposer-based packaging technologies
• Experience using data analytics, automation, or AI-enabled workflows to improve engineering efficiency
• Experience authoring technical papers, patents, or engineering documentation

Responsibilities

• Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects
• Design and execute experiments to qualify materials, process flows, and design rules for new package architectures
• Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics
• Drive technology transfer, including process qualification, design rules, material selection, and manufacturing readiness
• Warpage engineering: predict and mitigate wafer/die warpage via modeling, cure‑shrinkage controls, and material/process levers; validate with inline metrology.
• Collaborate with design, process, equipment, reliability, test, and manufacturing teams to deliver high-performance packaging solutions

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level