Backend of Line - Module Integration Engineer

Samsung Electronics•Taylor, TX

1d•Onsite

About The Position

Seeking an experienced Module Integration Engineer (MIE) for Back-end of Line (BEOL) semiconductor process. As a BEOL MIE, you will be responsible for metal interconnect process integration for the most advanced semiconductor tech node. This role involves driving improvements in Yield, Reliability, Performance, and competitiveness of products, mitigating production risk from BEOL module related technical issues, leading cross-functional teams (FE, MFG, QR, etc) to solve BEOL issues, and communicating with Leadership and HQ.

Requirements

Bachelor’s Degree or higher in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related field is required.
5+ years in BEOL process integration experience.
Must have excellent communication, documentation and presentation skills.
Ability to make and present Exec summaries required.
Prior experience leading Cross Functional Task Force Teams (TFT) is required.
Demonstrated ability to meet deadlines and commitments while having the capability of shifting focus and changing priorities - dealing with ambiguity.
Must have interpersonal skills to escalate issues, get support, and effect lasting change.
Must have proven skills of peer leadership, and mentoring of junior engineers.
Expertise in Design of Experiments is required.
Expert in Office Suites such as Excel and PowerPoint.
All positions at SAS are full-time on-site.
This role may require access to information subject to U.S. export control laws. Applicants must be authorized to access such information or eligible for government authorization.

Nice To Haves

Experience in fab unit processes (including Lithography, Etch, Diffusion, Thin Films Deposition, Wet Cleans, CMP, etc.) beyond BEOL process integration is highly preferred.
Experience in Data analyses software (ex: JMP, Spotfire, etc.) is plus.
Data Mining Programming and/or scripting experience is a plus.
Korean Language Skill is plus.

Responsibilities

Own Module Integration for specific segments within the Process flow.
Own all Systematic Defect and Device/Parametric Yield related issues for these steps by leading projects, include design of experiments and execution in a team setting, to fix the and/or improve detections.
Own critical dimension targeting and variation control within the Module.
Review Yield, Cost, Throughput related Process changes across the factory at Change Control Board.
Provide Yield risk assessment and failure modeling for factory incidents at Material Review Board.
Transfer Advance Tech Nodes from HQ.