Module Engineering PhD Intern 2027

Intel•Hillsboro, OR

22h•Onsite

About The Position

As a Module Engineering Intern within Intel's F25 Metals organization, you will work alongside engineers, technicians, and operations teams to support High Volume Manufacturing (HVM) of Intel's leading-edge semiconductor technologies. This role offers a unique opportunity to gain hands-on experience in semiconductor manufacturing while contributing to real-world engineering and operational challenges. Interns will own and execute a meaningful project focused on areas such as process improvement, manufacturing efficiency, equipment performance, automation, data analytics, quality systems, or operational excellence. In addition to their primary project, interns will participate in day-to-day engineering activities and engage with cross-functional stakeholders to gain a broad understanding of semiconductor manufacturing operations. Throughout the internship, you will learn how engineering decisions are made in a high-volume manufacturing environment by observing manufacturing workflows, analyzing data, identifying improvement opportunities, and communicating recommendations to technical and business partners. Interns are encouraged to explore multiple aspects of the organization through networking, mentorship, training, and collaboration across engineering disciplines. This internship provides opportunities to: Lead a project from problem definition through execution and final presentation Analyze manufacturing, equipment, and operational data to support decision making Apply structured problem-solving and continuous improvement methodologies Collaborate with engineers, technicians, quality teams, and operational stakeholders Develop technical communication and presentation skills Gain exposure to advanced semiconductor manufacturing technologies and operations Successful candidates will demonstrate curiosity, initiative, strong problem-solving abilities, and a desire to learn in a fast-paced manufacturing environment. This role is designed to provide meaningful industry experience while helping evaluate potential future engineers for full-time opportunities within Intel.

Requirements

Currently pursuing a PhD degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, or a related technical discipline.
Minimum GPA of 3.0.
Academic coursework or research experience in semiconductor processing, materials science, microelectronics, advanced materials, or a closely related field.
Availability to participate in a minimum 10 to 12-week summer internship.
3+ months of educational, research, laboratory, internship, or industry experience.
Ability to work onsite in Hillsboro, Oregon.

Nice To Haves

Previous internship, research, laboratory, project, or industry experience in engineering, manufacturing, data analytics, process development, or a related technical field.
Familiarity with semiconductor manufacturing, industrial operations, quality systems, continuous improvement, or complex technical environments.
Experience working with data analysis and visualization tools such as Python, JMP, MATLAB, Power BI, Excel, SQL, or similar platforms.
Knowledge of problem-solving and continuous improvement methodologies such as root cause analysis, 8D, SPC, Pareto analysis, Design of Experiments (DOE), Lean, or Six Sigma.
Demonstrated ability to analyze data, identify trends, and develop data-driven recommendations.
Experience breaking down complex problems into executable plans and managing multiple priorities simultaneously.
Experience collaborating on cross-functional projects involving technical and non-technical stakeholders.
Strong written, verbal, and presentation skills, including experience communicating technical concepts to diverse audiences.
Self-motivated with a demonstrated ability to learn quickly, ask questions, and take initiative in unfamiliar situations.
Experience creating technical documentation, reports, dashboards, presentations, posters, or project summaries.
Exposure to one or more of the following areas is a plus: Semiconductor manufacturing or process engineering, Automation or scripting, Data analytics and visualization, Equipment engineering, Quality systems and continuous improvement, Manufacturing operations, Materials science or device fabrication.

Responsibilities

Lead a project from problem definition through execution and final presentation
Analyze manufacturing, equipment, and operational data to support decision making
Apply structured problem-solving and continuous improvement methodologies
Collaborate with engineers, technicians, quality teams, and operational stakeholders
Develop technical communication and presentation skills
Gain exposure to advanced semiconductor manufacturing technologies and operations