Module Development Engineer

IntelHillsboro, OR
Onsite

About The Position

Intel Corporation is one of the world's most iconic technology companies, with more than five decades of innovation that has fundamentally shaped modern computing. From the first microprocessor to today's most advanced AI chips, Intel has consistently pushed the boundaries of what's possible in semiconductor technology. Our Intel Foundry Technology Development organization is at the forefront of this mission — pioneering the manufacturing processes and device architectures that will define the next generation of computing. We are a company that believes in the power of human ingenuity, and we're looking for exceptional engineers to help us write the next chapter. We are seeking a talented and driven Module Development Engineer to join our Technology Development team in Hillsboro, Oregon. In this role, you will be a key contributor to the development and optimization of Intel's most advanced semiconductor manufacturing processes. You will work at the intersection of materials science, process engineering, and device physics — conducting experiments, developing novel process solutions, and collaborating with world-class teams to bring next-generation semiconductor technologies to life. This is a rare opportunity to work on technology that is truly at the frontier of human knowledge, in one of the most advanced semiconductor R&D facilities in the world.

Requirements

  • A natural curiosity and passion for solving complex, ambiguous technical challenges.
  • Strong communication skills and the skills to clearly convey technical concepts to diverse audiences.
  • A collaborative mindset and genuine enjoyment of working across interdisciplinary teams.
  • Adaptability and resilience in a fast-paced, dynamic research and development environment.
  • A detail-oriented approach balanced with the willingness to see the bigger picture.
  • Self-motivation and the drive to take ownership of projects and deliver results.
  • An inclusive and respectful approach to teamwork that values diverse perspectives.
  • Bachelor’s degree in mechanical engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related STEM field, with 4+ years of hands-on semiconductor processing experience as described below — OR — Master's degree in a relevant field listed above, with 3+ years of domain-specific experience as described below — OR — PhD in a relevant field listed above (no prior professional experience required)
  • Relevant experience includes one or more of the following: Process characterization, Statistical Process Control (SPC), and/or Design of Experiments (DOE)
  • Knowledge of semiconductor manufacturing techniques, including lithography, etching, deposition, and/or chemical-mechanical planarization (CMP)
  • Experimental design, data analysis, and/or manufacturing process improvement
  • Expertise in thin film deposition technologies, vacuum process systems, and/or opto-mechanics

Nice To Haves

  • 4+ years of experience in: Advanced transistor architectures (FinFET, GAA) and semiconductor device fabrication
  • Materials characterization methods: SEM, TEM, XPS, ellipsometry, or similar techniques
  • Programming or scripting experience in Python, JMP, or MATLAB for process optimization or data analysis

Responsibilities

  • Develop, optimize, and sustain advanced semiconductor manufacturing processes, including material selection, equipment metrology, parameter tuning, and system design
  • Design and execute structured experiments (DOE) to achieve engineering specifications for device functionality, yield, and production output
  • Conduct feasibility studies and pathfinding efforts to support innovative device architectures and next-generation manufacturing roadmaps
  • Collaborate with equipment and materials suppliers to evaluate, qualify, and implement novel technology solutions into manufacturing processes
  • Perform process technology feasibility studies using theoretical simulations and practical engineering techniques
  • Stay current on industry trends and technology advancements to align development efforts with evolving semiconductor needs
  • Partner with cross-functional stakeholders and vendors to develop cost-effective technology roadmaps and meet operational goals

Benefits

  • competitive pay
  • stock bonuses
  • health
  • retirement
  • vacation
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