Join our Advanced Packaging Technology and Manufacturing team as a Module Development Engineer, Defect Inspection, where you will help enable next-generation semiconductor innovation. In this role, you will develop, optimize, and scale defect inspection solutions that support both current high-volume manufacturing (HVM) and future technology nodes. You will collaborate across engineering, suppliers, and research teams to improve inspection capability, drive yield improvements, and influence future process technologies.
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Job Type
Full-time
Career Level
Senior
Education Level
Ph.D. or professional degree