Module Development Defect Inspection Engineer

Intel•Hillsboro, OR

5d•Onsite

About The Position

Intel Corporation is a global technology leader and pioneer in semiconductor innovation, driving the future of computing, connectivity, and artificial intelligence. With decades of groundbreaking research and development, Intel empowers engineers, scientists, and technologists to solve the world's most complex challenges. At our Hillsboro, Oregon campus — one of the most advanced semiconductor research and manufacturing facilities in the world — we are building the technologies that will define the next generation of human progress. We are seeking a talented and driven Module Development Defect Inspection Engineer to join our world-class team in Hillsboro, Oregon. In this role, you will be at the forefront of semiconductor process development, driving technology enablement for both high-volume manufacturing and next-generation device architectures. You will collaborate with cross-functional teams, equipment and materials suppliers, and industry partners to develop and optimize cutting-edge manufacturing processes that push the boundaries of what's possible in semiconductor technology.

Requirements

Bachelor's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Chemistry, or a related STEM discipline, with 3 + years of relevant experience; or a master's degree in one of these fields with 2+ years of relevant experience; or PhD in the same fields with no experience.
Semiconductor processing, wafer-level assembly, or cleanroom environments.
Process development methodologies, statistical process control, and manufacturing process improvement.
Technical expertise in module engineering or fab process/hardware technology development.

Nice To Haves

3+ years of experience in any of the following: Metrology fundamental understanding and development experience.
Working with cross-functional teams, including yield and operations
Leverage data analysis tools for process optimization and continuous improvement.
Packaging processes, equipment automation development, or project management.

Responsibilities

Drive process integration and equipment solutions for both high-volume manufacturing and future technology nodes.
Perform feasibility studies to meet desired device specifications and develop roadmaps for enabling future technology.
Lead the design and development of sophisticated manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design to support new product designs and functional requirements.
Perform pathfinding activities supporting process and hardware development for innovative device architectures.
Recommend and implement equipment modifications to improve production efficiency, manufacturing techniques, and output optimization.
Partner with key equipment and materials suppliers to develop and implement enabling technology elements.
Build cost-sensitive roadmaps in collaboration with the vendor ecosystem.
Conduct process technology feasibility studies through theoretical simulations and practical engineering methods to validate new approaches and technologies.
Stay current on relevant industrial process and material manufacturing trends.
Develop a forward-looking view of Intel's future process technology needs to push the industry forward.