Module Design Engineer

Apple•Cupertino, CA

1d•$158,995 - $220,900•Onsite

About The Position

Imagine what you can do here. Apple is a place where extraordinary people gather to do their lives best work. Together we create products and experiences people once couldn’t have imagined, and now, can’t imagine living without. It’s the diversity of those people and their ideas that inspires the innovation that runs through everything we do. APPLE INC has the following available in Cupertino, California and various unanticipated locations throughout the USA. Architect and design the haptics subsystem, including components selections/requirements and schematics of boards and flexible assemblies. Run module and system simulation to proactively predict post-integration performance for items like power delivery, signal integrity and dynamic UX behavior. Work on system and module performance validation and lab characterization. Co-author and own test requirements definition and be the primary responsible person for failure analysis at both module and system level. Collaborate on proof-of-concept investigations of new sensing and actuator technologies, evaluating pros and cons in the context of the final user experience requirements. Co-author and own Engineering Requirements and Specifications documents for new Silicon chips used by Haptic modules. Follow vendors' progress in Silicon development and characterize these chips. International travel required 20%. 40 hours/week.

Requirements

Implementing system integration for various hardware technologies with microcontrollers, FPGA.
Performing failure analysis and hardware debugging to solve complex technical issues that arise during hardware development.
Generating functional and test specifications.
Bringing up hardware prototypes and evaluating performance using Software and bench tools.
Using big dataset statistical analysis to draw conclusions on hardware characterization.
Performing electromechanical system analysis, modeling and characterization.
Coding in MATLAB/Python for raw signal processing and statistical analysis.
Analyzing sensing systems within mechatronic platforms.

Responsibilities

Architect and design the haptics subsystem, including components selections/requirements and schematics of boards and flexible assemblies.
Run module and system simulation to proactively predict post-integration performance for items like power delivery, signal integrity and dynamic UX behavior.
Work on system and module performance validation and lab characterization.
Co-author and own test requirements definition and be the primary responsible person for failure analysis at both module and system level.
Collaborate on proof-of-concept investigations of new sensing and actuator technologies, evaluating pros and cons in the context of the final user experience requirements.
Co-author and own Engineering Requirements and Specifications documents for new Silicon chips used by Haptic modules.
Follow vendors' progress in Silicon development and characterize these chips.