About The Position

Qualcomm is the world’s largest fabless semiconductor company and a global leader in wireless innovation—powering the majority of 3G, 4G, and 5G devices while pioneering the future 6G era. Our hardware engineering teams build industry‑leading modem and RF transceiver solutions enabling the next generation of wireless technology. We are seeking a highly skilled Modem Hardware Design Engineer to join our advanced design organization, focused on AI‑driven methodologies and next‑generation modem hardware development. This role blends traditional design expertise with cutting‑edge GenAI, ML‑assisted flows, and agentic-AI automation frameworks to accelerate all phases of the project and deliver leading edge solutions across a wide range of portfolio products. As a Wireless Design Engineer, you will define specifications and architecture/micro-architecture, develop RTL, and optimize for area, power, and performance. You will collaborate closely within the hardware team comprising verification, modeling, and physical implementation teams, while also engaging with system, RF, firmware, and software teams to deliver first-time-right silicon.

Requirements

  • Bachelor's degree in Computer Engineering, Computer Science, Electrical Engineering, or related field.

Nice To Haves

  • Master's degree in Computer Engineering, Computer Science, Electrical Engineering, or related field.
  • 1+ year of experience with programming (e.g., C, C++, Python), Verilog, System Verilog, computer architecture, or embedded systems.
  • 1+ year of applicable wireless, semiconductor and/or embedded software industry experience.
  • 6+ months of WWAN modem development specific experience.
  • RTL coding and logic design for wireless modem ASICs.
  • Experience with synthesis, industry LINT, clock domain crossing, low power design, verification.
  • Experience with Unix/Linux shell scripting, Python/Perl, Makefiles, XML

Responsibilities

  • define specifications and architecture/micro-architecture
  • develop RTL
  • optimize for area, power, and performance
  • collaborate closely within the hardware team comprising verification, modeling, and physical implementation teams
  • engaging with system, RF, firmware, and software teams to deliver first-time-right silicon
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