Modeling Engineer

Saras Micro DevicesChandler, AZ

About The Position

Saras Micro Devices is a fully funded start-up company developing innovative power delivery solutions enabling further advancements and market adoption of high-performance computing, AI, virtual reality, 5G and more. Saras is developing this pioneering technology in partnership with industry-leading Fortune 500 companies and other innovative computing solution providers to support best-in-class, energy-efficient products. Our vision is to change the performance-to-power paradigm for next generation computing solutions through heterogeneously integrated Saras Micro Devices products. We look forward to talking with smart, energetic, team-oriented professionals who can grow with us. We provide competitive salary and benefit plans, and some of the best co-workers you’ll find anywhere. Our Values: Teamwork, Execution, Accountability, Recognition, Respect. Are you a talented Modeling Engineer looking for a new challenge and an opportunity to advance your skills and your career in a great working environment? We have the perfect job for you! Saras Micro Devices is seeking a highly proactive and skilled Modeling Engineer that is responsible for developing, validating, and deploying thermo-mechanical, electrical, and multi-physics simulation models that support the design, development, qualification, and optimization of advanced electronic components.

Requirements

  • M.S. in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or related engineering discipline.
  • 2+ years of experience in modeling, simulation, semiconductor packaging, electronics, or advanced materials development.

Nice To Haves

  • Finite Element Analysis (FEA)
  • HFSS
  • Maxwell
  • SI wave
  • Thermomechanical
  • Thermal modeling
  • Multi-physics simulation
  • Electromagnetic simulation
  • De-embedding techniques
  • Resonance and impedance analysis
  • ANSYS Mechanical
  • ANSYS Electronics Desktop
  • HFSS
  • SI Wave
  • COMSOL Multiphysics
  • Abaqus
  • Keysight ADS
  • Python
  • MATLAB
  • JMPLT Spice

Responsibilities

  • Develop and execute FEA simulations to predict: Component and substrate warpage, Thermo-mechanical stress and strain, CTE mismatch behavior, Delamination risk, Interconnect and via reliability, Mechanical fatigue life, Moisture-induced failures, Reflow-induced deformation
  • Model reliability performance under: Temperature cycling, Thermal shock, HAST/uHAST/bHAST exposure, High temperature storage, Vibration and mechanical shock
  • Correlate simulation results with experimental and reliability test data.
  • Develop electrical and electromagnetic models to predict: Capacitance, ESR, ESL, Impedance, Resonance behavior, S-parameters, Power delivery network performance
  • Support de-embedding methodologies for electrical characterization.
  • Develop equivalent circuit models for embedded passive devices and package structures.
  • Support signal integrity and power integrity analysis. (SI wave)
  • Build physics-based predictive models.
  • Establish model correlation plans.
  • Compare simulation results to measured data.
  • Improve model accuracy through calibration, tuning and validation activities.
  • Generate simulation methodologies, best practices, and standards.
  • Support technology down-selection and design decisions.
  • Provide simulation-driven recommendations to engineering teams.
  • Participate in DFMEA and risk assessments.
  • Support customer design reviews and qualification activities.
  • Contribute to Design Rule Manuals and product specifications.

Benefits

  • competitive salary and benefit plans
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