Microwave Technician II
About The Position
This position supports our Weekend Night Shift working Friday, Saturday and Sunday from 3:00 PM to 3:00 AM. You will work 36 Hours and be paid for 40 Hours plus earn a 15% pay premium. Our employees work on the world’s most advanced electronics – from detecting threats for F-35 pilots to illuminating the night for soldiers. Spanning air, land, sea, and space, we are developing the technology of tomorrow, delivered today. Drawing strength from our differences, we’re innovating for the future. And you can, too. Our flexible work environment provides you a chance to change the world without giving up your personal life. We put our customers first – exemplified by our mission: “We Protect Those Who Protect Us®.” Come build your career with BAE Systems. Electronic Combat Solutions (ECS) has technology, engineering and program teams that educate and mentor colleagues to deliver leading Electronic Warfare capabilities. We welcome all those who have big ideas, crave innovation, want to drive fielding velocity, and have the passion to bring the warfighter home safely. The MRSI Die Bonding Assembly Technician is responsible for the high-precision attachment of semiconductor dies to substrates, specifically within the production of RF and microwave components. This role requires extreme attention to detail, mastery of micro-assembly techniques, and the ability to work under high-magnification optics to ensure the electrical and mechanical integrity of mission-critical components.
Requirements
- High School Diploma or equivalent
- Proven proficiency in die attach processes and the use of precision tooling.
- Excellent hand-eye coordination and the ability to perform repetitive tasks under a microscope for extended periods.
- Ability to sit or stand for long periods while performing precision work.
- Manual dexterity required for handling fragile components and small tools.
- Ability to work in a controlled cleanroom environment.
Nice To Haves
- Familiarity with the unique requirements of RF/Microwave components (e.g., minimizing parasitic inductance, managing thermal expansion).
- Experience with ultrasonic wire bonding or flip-chip technology.
Responsibilities
- Perform precision die bonding using various methods, including epoxy bonding and eutectic bonding, ensuring accurate placement and orientation of dies on substrates.
- Operate and maintain automated and semi-automated die bonders and curing ovens.
- Utilize high-power microscopes for alignment, inspection, and verification of bond quality and die placement.
- Conduct visual inspections and perform in-process quality checks to ensure components meet strict RF microwave specifications and tolerances.
- Maintain accurate production logs, route sheets, and quality reports.
- Document any deviations or non-conformances in accordance with factory standards.
- Work closely with Process Engineers to optimize bonding parameters and troubleshooting assembly failures.
Benefits
- health, dental, and vision insurance
- health savings accounts
- a 401(k) savings plan
- disability coverage
- life and accident insurance
- employee assistance program
- legal plan
- discounts on things like home, auto, and pet insurance
- paid time off
- paid holidays
- paid parental leave
- paid military leave
- paid bereavement leave
- any applicable federal and state sick leave
- company recognition program to receive monetary or non-monetary recognition awards
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
Education Level
High school or GED
