The Microsystems Integration Group is seeking staff for design and manufacturing process development of multi-die, micron-scale electronic systems for research, commercial, and national defense applications. The candidate will be part of a team that employs both industry-standard and bespoke methods of electronics packaging including precision component alignment, bonding, 3-D electrical connect, and ruggedization applied to functional low rate production end products. Experience in a microfabrication and/or micro-assembly laboratory environment and excellent communication and analytical skills are required. Familiarity with concepts in heterogeneous electronics integration and packaging are desired. The candidate should understand microelectronics metrology techniques such as SEM, X-ray, and optical microscopy. The role will support multiple interdisciplinary programs and will require a candidate who is comfortable conducting experiments, analyzing data, and presenting results. System design and experience on multidisciplinary team including vendors and external technologies is critical. The candidate should have a background in electrical, mechanical, chemical, and/or materials engineering and have demonstrated examples of self-driven efforts in technical areas outside their academic training. The candidate will work in a diverse team-based environment alongside technical staff of varying levels of expertise to execute technical tasks and communicate technical matters to engineering and management.
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Job Type
Full-time
Career Level
Entry Level
Number of Employees
501-1,000 employees