About The Position

At Meta, we are developing the future of AR/VR displays. We are seeking an Advanced Manufacturing Engineer to join our team and drive the ramp-up of RGB microLED chips used in display modules to mass production, and enable key metrics related to performance, yield, quality, cost, supply and reliability to be met. This is a high-impact role focused on managing, sustaining and improving the manufacturing line at a key external partner. This Engineer will be adaptable individual with versatile, cross-disciplinary experience in semiconductor epitaxy, device fabrication, yield engineering, failure analysis, and statistical process control, with demonstrated experience in solving unfamiliar problems and influencing decisions with a broad range of stakeholders and partners.

Requirements

  • Masters or PhD in microelectronics, physics, electrical engineering, materials science, or a related field
  • 5+ years of experience with optoelectronic device fabrication and/or process integration
  • 5+ years of experience with managing external partners (e.g., contract manufacturers)
  • 2+ years of experience managing and analyzing large data sets, specifically for yield analysis and management
  • 2+ years of experience with Design of Experiment (DOE), structured problem solving and statistical data analysis (JMP, Minitab, Tableau, etc.) and statistical process control (SPC) methodology
  • Broad experience and expertise in semiconductor materials, device fabrication processes, process integration and device architecture
  • Understanding of failure analysis techniques including SEM, TEM, EDS, etc
  • Understanding of factory operational readiness metrics including IQC, IPQC, OQC, FMEA, control plans, yield, GRR, UPH, OEE, MMR)
  • Understanding of cleanroom management principles
  • Experience working in cross-discipline teams and drive convergence on solutions that optimize across multiple technology layers

Nice To Haves

  • Experience in III-V semiconductor optoelectronic devices (GaN/GaAs material systems)
  • Experience with microLED process development or process integration
  • Experience in optoelectronic device packaging and assembly processes
  • Background in semiconductor device physics and/or materials science
  • Experience with emerging display technologies and associated fabrication and integration challenges
  • Experience with technology transfer and ramp to high-volume manufacturing

Responsibilities

  • In this role, you will apply your end-to-end expertise and ownership through the NPI engineering and production ramp phases for RGB microLEDs, from epitaxy through the device fabrication process and end-of-line test.
  • You will define and own key performance indicators (KPIs) such as yield, process capability, cycle time and OEE, and will devise and lead improvement plans to meet these targets.
  • You will work closely with the external partner to proactively identify and resolve technical and operational risks, and drive containment, failure analysis and corrective actions for technical issues.
  • You will work with internal customers to understand and address downstream technical issues related to the microLED design and process, and drive convergence on device-level specifications based on evolving system requirements.
  • Additionally, you will own the yield bridge and drive actions towards meeting targets
  • External Partner Management: Lead technical engagement for sustaining and manufacturing operations at a partner site
  • NPI and Manufacturing: Drive high-volume ramp and MP readiness, sustain production
  • Yield & Performance: Define and own key performance indicators (KPIs); execute yield roadmap, drive root cause analysis, drive cycle time and cost reduction
  • Manufacturing rigor: Establish and drive FMEA, SOPs, process characterization reports, control plan, OCAP, etc
  • Cross-Functional Leadership: Drive cross-functional teams, resolve downstream integration issues, drive spec convergence, report status to management
  • Roadmapping: Drive long-term microLED manufacturing roadmap for cost reduction
  • Travel ~25% to external partner site(s) for onsite-support

Benefits

  • bonus
  • equity
  • benefits
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