Microelectronics Research Scientist

TAP Engineering • College Park, MD

9d • $80,000 - $230,000

About The Position

TAP Engineering is seeking a Microelectronics Research Scientist in College Park, Maryland, to support applied research focused on the design, inspection, analysis, manufacturing, packaging, and testing of state-of-the-art semiconductors. The role calls for the ability to envision and articulate new research areas and novel approaches. In a dynamic environment, the scientist will lead efforts, provide guidance, transition efforts for future development, and monitor ongoing progress. Technical leadership without supervisory responsibility is strongly desired, along with clear, professional communication.

The research team includes scientists at multiple levels, from junior to principal, based on education and experience. The role requires experience in two or more of the specified microelectronics or hardware-programming areas. U.S. citizenship is required. Candidates with an active TS/SCI clearance and appropriate polygraph are preferred; candidates without clearance must be able to obtain and maintain a TS/SCI clearance through U.S. Government processing.

Requirements

• Experience in two or more of the following areas: microelectronics supply chain; wafer-level design; wafer-level fabrication and test; chip-scale design; chip-scale fabrication and test; or hardware programming.
• Microelectronics supply-chain experience may include hardware verification, security, trust or assurance; vendor selection, qualification, audit or procurement; and domestic foundry interaction.
• Wafer-level design experience may include digital, RF or mixed-signal circuit design, schematic or layout work, and modeling or simulation of circuit parameters such as power, speed, timing, signal integrity, thermal performance or reliability.
• Wafer-level fabrication and test experience may include circuit patterning, wafer-level packaging, electrical test and debug, microscopy, metallurgy, failure analysis, repair, and back-end processing.
• Chip-scale design experience may include digital, RF or mixed-signal device packaging design or layout; 2D–3D or chiplet/UCIe design; substrate or interposer design; chip attach and interconnect; and modeling or simulation of relevant electrical, thermal, structural or reliability parameters.
• Chip-scale fabrication and test experience may include substrate or interposer fabrication, chip attach and interconnect, underfill, lidding, balling, tinning or forming, electrical test and debug, inspection, metrology, and failure analysis.
• Hardware-programming experience may include FPGA programming with Verilog or VHDL and programming with Linux command line or scripting, Python, Java, or C++.
• U.S. citizenship is required.
• Ability to obtain and maintain a TS/SCI security clearance if not already cleared.
• Level 1 qualification: no degree with 6 or more years of experience; bachelor’s degree with 2 or more years of related experience; or master’s degree with 1 or more years of related experience.
• Level 2 qualification: no degree with 12 or more years of experience; bachelor’s or master’s degree with 6 or more years of related experience; or Ph.D. with 4 or more years of related experience.
• Level 3 qualification: no degree with 16 or more years of experience; bachelor’s degree with 12 or more years of related experience; master’s degree with 10 or more years of related experience; or Ph.D. with 8 or more years of related experience.

Nice To Haves

• Experience collaborating with federal research laboratories, academic institutions, and commercial entities in the microelectronics ecosystem on collaborative research programs.
• Ability to communicate effectively and efficiently in a dynamic, interdisciplinary environment.
• Active TS/SCI security clearance with appropriate polygraph.
• Ability to understand current limitations and determine future improvements in the relevant technical areas.

Responsibilities

• Provide technical support and expertise in state-of-the-art microelectronics engineering and research, including developing, testing, and documenting experiments.
• Assimilate and integrate technical inputs from performers and analyze technical deliverables and reports.
• Assist the government’s technical element in managing the microelectronics research portfolio.
• Conduct technical writing and prepare presentation materials.
• Independently review and summarize related technical literature and emerging technologies, and participate in technical exchanges and workshops related to program technical areas.
• Develop and document testing methodologies and protocols, ensuring alignment with program technology components.
• Coordinate, align, and schedule technology-development tasks, and continuously analyze technical progress against planned cost and schedule.
• Conduct technical and programmatic risk analysis and review, and track risks.

Benefits

• Paid time off of 15–25 days annually based on tenure, plus 11 paid holidays.
• Up to 15% employer contribution to a 401(k) through match and profit sharing.
• Free medical insurance for employees, with optional dependent buy-up plans.
• Employer-paid dental and vision plans, with optional enhancements.
• Employer-paid life insurance, AD&D, short-term disability, and long-term disability coverage.
• Healthcare and dependent-care flexible spending accounts.
• Tuition reimbursement up to $36,000 per year for approved coursework.
• Employee Assistance Program, wellness incentives, discount programs, virtual care, prescription savings, and travel support.
• Merit increases, performance bonuses, and referral bonuses.

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level
• Education Level: No Education Listed