Microelectronics Assembler – Hybrid Thick-Film

UEC Electronic•Rochester, NY

23d

About The Position

The Microelectronics Assembler performs precision assembly and processing of hybrid thick-film microelectronic components in a Class 10K cleanroom environment. The work involves delicate, lightweight components and ceramic substrates, using microscopes, precision tools, and specialized manufacturing equipment. The role requires strong manual dexterity, attention to detail, and the ability to follow detailed work instructions while maintaining high standards of workmanship and quality. Experience in microelectronics or precision manufacturing is preferred, although candidates with appropriate skills and aptitude may be considered. Work is performed in a controlled manufacturing environment with cleanroom garments, personal protective equipment (PPE), and ESD protection as applicable. The role may involve exposure to adhesives, solvents, processing chemicals, and heated equipment, subject to established safety procedures.

Requirements

High school diploma or equivalent required.
Ability to perform detailed manual assembly using a microscope and precision hand tools for extended periods.
Excellent manual dexterity and hand-eye coordination, including the ability to handle extremely small, lightweight, and delicate components.
Strong attention to detail and commitment to quality workmanship.
Ability to read and follow detailed work instructions, engineering drawings, and manufacturing documentation.
Basic computer skills for production documentation and recordkeeping.
Ability to work independently while contributing to a team-oriented manufacturing environment.
Willingness to learn specialized processes and equipment.
Ability to sit or stand for extended periods while performing microscope-assisted assembly.
Sufficient fine motor control, hand-eye coordination, and visual acuity to perform precision assembly and inspection under magnification.
Ability to maintain consistent, careful hand movements while working with small, delicate components.

Nice To Haves

Technical training or certification in electronics or a related field.
Previous experience in microelectronics assembly, hybrid circuit manufacturing, thick-film processing, semiconductor assembly, or another precision manufacturing environment.
Familiarity with ESD controls, cleanroom practices, and precision assembly techniques.

Responsibilities

Perform precision assembly of hybrid thick-film microelectronic components using microscopes, tweezers, and specialized hand tools.
Handle extremely lightweight and delicate components carefully to prevent damage, contamination, or defects.
Perform microelectronic assembly processes such as die attach, die bonding, wire bonding, soldering, and epoxy dispensing, as required.
Print and fire ceramic substrates in support of thick-film circuit manufacturing.
Operate specialized microelectronics equipment, including wire bonders, dispensing equipment, ovens, and inspection tools.
Follow detailed work instructions, engineering drawings, process specifications, and manufacturing travelers.
Inspect components and assemblies under magnification to verify workmanship and conformance to quality requirements.
Accurately document completed operations, inspection results, and production records.
Work with engineering and quality personnel to address manufacturing issues and maintain product quality.
Maintain cleanroom protocols, electrostatic discharge (ESD) controls, and applicable safety requirements.
Maintain a clean, organized work area and comply with established contamination-control procedures.
Perform other related manufacturing duties as required.