Memory Package Integration Architect

Micron • Boise, ID

7d • Onsite

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the team defining the future of packaging of complex memory systems! Our Package pathfinding and Architecture organization sits at the intersection of silicon, packaging, systems, and customer needs—turning complex scaling challenges into technologies that power next generation platforms, through cutting edge packaging technologies. If you enjoy working on problems with real industry impact, look no further! This is a technical pathfinding role driving forward-looking packaging technology for next generation memory systems from datacenter to edge-AI. You will leverage understanding of end to end memory system architectures, to guide long term package technology direction, and partner with customers, to build innovative ideas into scalable products. You will interface between package process technology, materials, electrical, thermo-mechanical and system performance areas to guide the package strategic roadmaps for Micron.

Requirements

• Master’s degree or equivalent practical experience in EE, CE, CS, or related field
• 6+ years of Extensive hands‑on experience in memory systems package design, signaling, IO design, PDN design
• Deep understanding of memory timing, signaling, power, package process technology
• working knowledge of EDA tools for design, analysis and simulation of electronic packaging, including but not limited to Cadence, Siemens and Ansys tools
• Experience applying AI or LLMs for engineering efficiency

Nice To Haves

• Master’s degree or PhD in a related technical field
• Recognized technical leadership across multiple products
• Experience in Signal and Power integrity analysis and mechanical and reliability analysis, thermal analysis
• Expertise in memory systems architecture

Responsibilities

• Define next‑generation package pathfinding and system architectures optimizing for speed performance, system bandwidth, power, capacity, thermal, mechanical and electrical performance.
• Lead cross‑stack co‑optimization across silicon, package, board, and system with package centric solutions approach
• Drive long‑term memory technology packaging strategy and influence industry standards
• Work closely with silicon, and system design teams and customers for next generation and long term disruptive solutions to boost speed performance for edge-AI and datacenter memory products
• Serve as a technical interface to internal partners, customers, BUs, senior leaders.
• Develop AI based multi-physics solutions for efficiency gains

Benefits

• choice of medical, dental and vision plans
• benefit programs that help protect your income if you are unable to work due to illness or injury
• paid family leave
• robust paid time-off program
• paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Senior