Mechanical Thermal Engineer

Powerlattice Technologies Inc.•Vancouver, WA

1d•$100,000 - $130,000•Onsite

About The Position

Powerlattice is a well-funded semiconductor start-up company backed by leading Silicon Valley venture capital firms. We are developing groundbreaking chiplet power delivery technology that will transform how high-performance processors are powered, enabling the next generation of AI and advanced computing. We are seeking a motivated Mechanical Thermal Engineer with 1-3 years of experience to support the development of advanced mechanical and thermal solutions for semiconductor packaging and AI computing platforms. In this role, you will work closely with thermal, structural, package, reliability, and manufacturing engineers to design, prototype, test, and validate components that enable next-generation chiplet technologies. This position offers an opportunity to gain hands-on experience in thermal engineering, mechanical design, semiconductor packaging, and product development while contributing to innovative technologies for future AI infrastructure. As a Mechanical Thermal Engineer, you will contribute to the development of mechanical and thermal solutions that improve product performance, reliability, and manufacturability. Your work will support engineering teams from concept development through prototype validation and product release.

Requirements

BS or MS in Mechanical Engineering or a related engineering discipline.
1-3 years of experience in thermal engineering or mechanical design, product development, or related engineering roles.
Understanding thermal testing, heat transfer fundamentals and simulation tools such as FloEFD/Flotherm, ANSYS Icepak, Fluent, COMSOL, or equivalent.
Understanding of mechanical engineering fundamentals including structural mechanics, materials, and manufacturing processes.
Experience with 3D CAD software such as SolidWorks, Creo or similar platforms.
Experience creating detailed engineering drawings and applying GD&T principles.
Strong analytical, organizational, and problem-solving skills.
Effective written and verbal communication skills.
Ability to work in a fast-paced, collaborative engineering environment.

Nice To Haves

Exposure to semiconductor packaging, electronics hardware, data center systems, and semiconductor packaging qualification testing
Experience using simulation tools such as FloTherm/FloEFD, Abaqus, ANSYS Icepak/Mechanical, SolidWorks Simulation, or COMSOL.
Familiarity with thermal interface materials, heatsinks, cold plates, and electronics cooling concepts.
Experience supporting laboratory testing, instrumentation, and prototype validation activities.
Familiarity with manufacturing methods such as CNC machining, sheet metal forming, plastic 3D printing and metal additive manufacturing

Responsibilities

Support the design and test of heatsinks, cold plates, retention mechanisms, fixtures, mechanical supports, and package integration hardware.
Execute laboratory testing, collect data, and document results.
Analyze test results and support root-cause investigations related to mechanical, thermal, or reliability performance.
Perform basic thermal analyses under the guidance of senior engineers.
Create and maintain detailed 3D CAD models, assemblies, and engineering drawings for mechanical and thermal components.
Interface with suppliers and fabrication partners to support prototype builds and component sourcing.
Conduct tolerance stack-up analyses and support GD&T implementation for mechanical assemblies.
Partner with electronics hardware and semiconductor packaging and development teams to guide thermal and mechanical needs and design.
Maintain engineering documentation, test reports, specifications, and design records.