Mechanical Simulation Engineer

SK hynix America•San Jose, CA

3h•$105,000 - $160,000•Onsite

About The Position

SK hynix America is seeking a highly skilled and motivated Mechanical Simulation Engineer to join our Advanced Packaging (PKG) R&D team. In this role, you will be at the forefront of semiconductor innovation, driving the mechanical integrity of next-generation packaging solutions (e.g., HBM, 2.5D/3D Heterogeneous Integration). You will utilize advanced numerical methods to predict and optimize the thermos-mechanical behavior of complex IC packages, ensuring high performance and structural robustness. Additionally, you will bridge the gap between package-level integrity and system-level performance, ensuring our packaging solutions are robustly integrated into data center rack architectures and consumer systems.

Requirements

Master’s degree or higher in Mechanical Engineering, Materials Science, or a related field. Candidates with relevant industry experience are preferred
Deep understanding of solid mechanics, heat transfer, and strength of materials, specifically applied to semiconductor packaging.
Extensive experience with commercial FEA software such as ABAQUS (preferred), ANSYS Mechanical, or LS-DYNA.
Proven knowledge of semiconductor packaging structures (Flip-chip, WLCSP, 2.5D/3D IC) and the physics of failure in electronic assemblies.
Ability to interpret complex simulation data and translate it into actionable engineering recommendations.
Experience or strong knowledge in mechanical simulation/testing at the system or set level, with preferred exposure to data center rack architectures, desktop form factors, or enterprise-level hardware systems.

Nice To Haves

Experience in Multi-scale modeling (from micro-scale TSV/micro Bumps to macro-scale Package/PCB).
Strong scripting skills in Python to automate Abaqus workflows, including pre-processing, job submission, and customized post-processing/data extraction.
Proficiency in statistical analysis and DOE (Design of Experiments) using tools such as JMP or Minitab to interpret simulation and experiment data.
Knowledge of semiconductor manufacturing processes (Reflow, Molding, Bonding) and their impact on residual stress.
Experience with CAD software (NX, Solidworks, or AutoCAD) for geometry preparation and cleaning.
Excellent communication skills to collaborate effectively within a multidisciplinary, global R&D environment.

Responsibilities

Develop high-fidelity, non-linear Finite Element Analysis (FEA) models to characterize stress, strain, and warpage behavior in advanced semiconductor packages during assembly processes and reliability tests.
Perform complex thermo-mechanical multi-physics simulations to evaluate the impact of thermal gradients on structural integrity and fatigue life.
Partner closely with package designers and process engineers to provide simulation-driven design directions, optimizing architectures for warpage control, solder joint reliability, and interfacial adhesion.
Define and implement material constitutive models (elastic, plastic, viscoelastic, etc.) for various packaging materials (EMC, Substrate, Silicon, TIM) and correlate simulation results with empirical data (e.g., Shadow Moire, DIC).
Predict potential failure modes (delamination, cracking, bump fatigue) and develop mitigation strategies to meet stringent industry reliability standards.
Establish and document standardized simulation workflows, advanced meshing techniques, and automation scripts to enhance simulation accuracy and throughput.
Present technical findings and simulation-based risks to internal stakeholders and global R&D teams to influence product roadmaps and manufacturing process specs.
Evaluate the thermo-mechanical interactions between advanced packages and board/system-level components (e.g., Motherboard, Rack, Cooling systems), mapping system-level boundary conditions down to the package level.