The Summer 2027 Mechanical Testing intern will support a reliability study of brittle materials, focusing on component-level testing including Ring on Ring, Four Point Bend, Digital Imaging Correlation (DIC), and Failure Mode Analysis. Under the guidance of technical staff, the intern will review literature, characterize materials, support reliability testing, develop hypotheses, and correlate observed behavior with measured materials. The intern will conduct component-level testing on mechanically advantaged thin glass materials and DIC on system-level consumer electronic products and pucks, including analysis of strain and stress data. The position also involves designing and executing experiments, characterizing brittle glass-based multi-material systems using available laboratory methods, documenting results, supporting reliability testing, and conducting Failure Mode Analysis. This position does not support immigration sponsorship. The stated pay range is $1,635.00–$3,185.00 biweekly; starting pay is prescribed based on geographic location, nature of position, and year in school.
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Career Level
Intern