Nokia is hiring one Mechanical Packaging Engineer Co-op for a four-month term from January 2027 through April 2027. The position is onsite in Sunnyvale, California, or New York, New York. The role supports mechanical packaging design, analysis, testing, and product validation. The successful candidate will perform mechanical integrity and thermal simulations, tolerance analyses, and characterization; support advanced packaging components and test fixtures for new products using 3D software; and generate manufacturing drawings. The role also applies Design for Manufacturing principles, keeps current with technological advancements, and drives package-debug activities during product validation and qualification. Applicants should be current M.S. or Ph.D. students in mechanical engineering, physics, or a similar or related field at an accredited U.S. school. Nokia describes student benefits including flexible and hybrid working schemes, professional development and networking, well-being programs, employee resource groups, mentorship and coaching, and a learning environment that supports personal and professional development.
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Career Level
Intern