Mechanical Engineering Lead - Avionics

Firefly Aerospace

About The Position

Firefly Aerospace is hiring a Mechanical Engineering Lead for its avionics team. The role focuses on designing and developing electronics enclosures, mechanical components, integration hardware, tooling, and test fixtures for launch vehicles and spacecraft. The lead will own complex avionics subsystems, guide design architectures, mentor engineers, and contribute technical leadership across the avionics team. The position covers the full product lifecycle, including advanced design, engineering analysis, hands-on build and integration, and qualification testing. The lead will collaborate with multidisciplinary teams to deliver reliable products for demanding spaceflight environments.

Requirements

Bachelor of Science in Mechanical Engineering, Aerospace Engineering, or a related technical field.
At least 5 years of professional industry experience designing high-reliability electronics packaging and electro-mechanical assemblies; aerospace, defense, or automotive experience is preferred.
Experience with 3D CAD design and geometric dimensioning and tolerancing.
Track record of taking complex electro-mechanical products from initial concept through environmental qualification and production.
Must be a U.S. citizen, lawful permanent resident, protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain required U.S. Department of State authorizations, to comply with U.S. space technology export regulations including ITAR.

Nice To Haves

Proficiency with NX CAD and finite element analysis tools such as ANSYS.
Experience designing multi-layer PCBA enclosures, including complex thermal interface materials and CTE analysis.
Strong understanding of structural and thermal calculations, including vent analyses, EMI/EMC shielding, worst-case tolerance stack-ups, bolt pre-loads, and Steinberg PCB solder-joint fatigue-life predictions.
Systems-level understanding of launch vehicle architectures, instrumentation interfaces, and avionics master networks.
Expert knowledge of manufacturing methodologies such as 5-axis CNC machining, sheet metal, and additive manufacturing, plus material and plating selection for spaceflight environments.
Experience working with external vendors and manufacturing partners to resolve DFM issues and expedite production.

Responsibilities

Lead design and architecture of ruggedized electronics packaging and structural components for PCB assemblies used in launch vehicles and spacecraft.
Design and optimize complex electro-mechanical assemblies for extreme thermal and dynamic environments, EMI/EMC compatibility, and radiation resistance.
Perform and review steady-state, transient, and thermal-cycling analyses of electronics in space environments.
Perform and review modal, random-vibration, and shock analyses of electronic assemblies to ensure structural integrity during launch.
Oversee design of high-reliability test fixtures and ground support equipment for launch vehicle and spacecraft electronics.
Define, execute, and lead vibration, shock, and thermal-vacuum environmental test campaigns for product qualification and acceptance.
Create CAD models, engineering drawings, and technical documentation; lead formal PDR and CDR design reviews and present to leadership.
Coordinate with the PCB design team on mounting strategies, keep-outs, tolerance stack-ups, connector placement, and thermal management solutions.
Mentor junior and mid-level engineers, establish design best practices, and review their technical work.