Mechanical Engineering Intern: Rugged Compute Payloads
About The Position
Field AI is transforming how robots interact with the real world. We are building risk-aware, reliable, and field-ready AI systems that address the most complex challenges in robotics, unlocking the full potential of embodied intelligence. We go beyond typical data-driven approaches or pure transformer-based architectures, and are charting a new course, with already-globally-deployed solutions delivering real-world results and rapidly improving models through real-field applications. About the Job At Field AI, we build autonomous robotic systems that operate in demanding, real-world environments where reliable hardware is just as critical as the software running on it. We’re looking for a driven, hands-on Mechanical Engineering Intern to own the mechanical design and thermal management of a new ruggedized compute payload for our robotic platforms. In this role, you will be responsible for full-cycle hardware development: from initial concepts and Solidworks CAD, to sizing heat sinks using first-principles and hand calculations, to working directly with machine shops to get your parts fabricated. You will sit with our hardware team and see your designs built, integrated, and deployed on real robots.
Requirements
- Currently pursuing a BS or MS in Mechanical Engineering, Aerospace Engineering, or a related field.
- Strong proficiency in Solidworks for 3D part design, large assemblies, and 2D drafting.
- Solid understanding of thermodynamics and heat transfer, with the ability to perform practical hand calculations for thermal management (e.g., heat sink sizing, conduction/convection estimates).
- Hands-on experience with prototyping and fabrication (e.g., manual machining, 3D printing, sheet metal) and a strong understanding of Design for Manufacturability (DFM).
- Excellent communication skills, particularly when communicating technical requirements and tolerances to machine shops.
- A strong ownership mindset and a desire to build hardware that works in the real world, not just on paper.
Nice To Haves
- Active participation in a hands-on student design team (e.g., Formula SAE, Baja SAE, Rover teams, or Robotics clubs).
- Prior project or internship experience involving electronics packaging, ruggedized enclosures, or thermal management.
- Familiarity with environmental testing concepts (e.g., shock, vibration, IP water/dust ratings).
- Experience with basic FEA/CFD tools for validating hand calculations.
Responsibilities
- Own the Payload Design: Use Solidworks to design robust, ruggedized enclosures and mounting systems for our edge-compute modules.
- Thermal Management: Apply engineering rules of thumb, hand calculations, and first principles of heat transfer to design and size heat sinks, ensuring our compute platforms stay cool in harsh outdoor environments.
- Prototyping & Fabrication: Create detailed manufacturing drawings and collaborate directly with internal and external machine shops to fabricate your designs.
- Hardware Integration: Work hands-on to assemble your payload, integrate it onto our wheeled robotic platforms, and validate its mechanical and thermal performance.
- Iterate and Improve: Participate in design reviews, analyze field testing data, and rapidly iterate on your mechanical designs to improve SWaP (Size, Weight, and Power).
Benefits
- We celebrate diversity and are committed to creating an inclusive environment for all employees.
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
What This Job Offers
Career Level
Intern
Education Level
Associate degree
