Mechanical Engineer

Advanced Micro Devices, Inc•San Jose, CA

10h•Hybrid

About The Position

As a Mechanical Engineer within AMD’s AECG Embedded team, you will play a key role in developing advanced thermal-mechanical solutions for next-generation SoC, CPU, and GPU products. You’ll work at the intersection of design, simulation, and validation—contributing to cooling technologies, package integration, and system-level reliability. This is a highly collaborative role where you’ll partner with cross-functional teams to deliver high-performance, manufacturable solutions.

Requirements

Bachelor’s, Master’s, or PhD in Mechanical Engineering, Mechatronics, or a related field

Nice To Haves

Experience in mechanical product development, with exposure to semiconductor packaging or thermal cooling design
Proficiency in FEA tools (e.g., ANSYS) for structural and thermal analysis
Strong 3D CAD skills (Creo, Pro/E, SolidWorks) and understanding of GD&T and tolerance analysis
Familiarity with DFM/DFA principles and reliability considerations
Working knowledge of warpage and failure analysis techniques (e.g., DIC, Shadow Moiré, X-ray, C-SAM)

Responsibilities

Design and validate thermal solutions for SoC, CPU, and GPU products (e.g., heat sinks, vapor chambers, liquid cooling cold plates, fan modules)
Perform thermal-mechanical FEA simulations across package, board, and system levels to optimize stress, warpage, and reliability
Evaluate and integrate new materials and packaging technologies to enhance performance and product robustness
Support DFM/DFA activities and ensure designs meet manufacturability, cost, and quality targets
Conduct characterization and validation using techniques such as DIC and warpage measurement tools
Collaborate in cross-functional design reviews and drive issue resolution from development through production
Partner with suppliers to ensure scalable, high-quality manufacturing solutions
Develop technical documentation including specifications, reports, and analysis results