Mechanical Engineer

KYOCERA SLD LASER INC•Tucson, AZ

20d•$93,000 - $110,000•Onsite

About The Position

We are seeking a highly motivated Mechanical Engineer with strong expertise in thermal and thermal mechanical simulations, solder materials and attach processes, wire bond process and epoxy materials to support the design, development, and reliability of advanced products. This role will focus on thermal management, materials selection, and process development to ensure robust performance and manufacturability. The ideal candidate will have hands-on experience with thermal modeling tools, a deep understanding of heat transfer, and practical knowledge of soldering and adhesive systems used in high-performance assemblies.

Requirements

Bachelor's or Master's degree in Mechanical Engineering or related field
3–8+ years of relevant industry experience
Strong understanding of heat transfer principles (conduction, convection, radiation) and key factors of a real thermal system to be able to convert it to a solvable model and get a desired accurate result.
Hands-on experience with thermal simulation tools (e.g., Solidworks Simulation, SolidWorks Flow Simulation, ANSYS, COMSOL…)
Experience with solder attach processes (die attach, SMT, reflow profiles, reliability concerns such as intermetallic compound formation, voiding, fatigue)
Knowledge of epoxies and adhesives, including material properties, curing mechanisms, and application methods
Knowledge of hermetic packages, hermeticity definition, as well as how to design it, manufacture it and test it.
Familiarity with thermal interface materials (TIMs) and packaging concepts
Experience with lab testing and instrumentation (thermocouples, IR cameras, data acquisition)
Strong analytical and problem-solving skills

Nice To Haves

Experience in semiconductor packaging, optoelectronics, or high-power electronics
Knowledge of DFM (Design for Manufacturability) and DFR (Design for Reliability)
Background in finite element analysis (FEA) for structural and thermo-mechanical modeling
Understanding of materials reliability, including CTE mismatch, fatigue, and creep
Experience with failure analysis techniques (cross-sectioning, microscopy)
Familiarity with industry standards (MIL, ISO, IATF)
Programming or scripting skills (Python, MATLAB, JMP) for data analysis
Experience working in a fast-paced, cross-functional development environment

Responsibilities

Perform thermal simulations and analyses (steady-state and transient) to optimize product performance and reliability
Develop and validate thermal models using tools of Solidworks Simulation (FEA), Solidworks Flow Simulation (CFD) or equivalent tools experiences, such as ANSYS, COSMCOL etc.
Design and evaluate thermal management solutions (heat sinks, interfaces, TIMs, cooling strategies)
Lead or support solder attach process development, including die attach, component attach, and reflow processes
Support wire bond process development by defining tools, wires and process parameters to meet product performance and reliability requirements.
Select and qualify epoxies and adhesive materials for structural bonding, encapsulation, and thermal interface applications
Collaborate with cross-functional teams (electrical, materials, manufacturing, reliability) to ensure design integration.
Conduct failure analysis and root cause investigations, with a focus on thermal and material-related issues
Define and execute design validation tests (DVT), including thermal cycling, shock, and environmental testing
Support manufacturing scale-up by developing process specifications, work instructions, and quality criteria
Analyze test data and provide recommendations for design and process improvements