Mechanical Engineer Intern

Keysight Technologies, Inc.•Santa Rosa, CA

About The Position

Keysight is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~16,800 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.

Requirements

  • Working towards a degree in Mechanical Engineering or related field at an accredited university
  • A strong interest in the mechanical design of electronics packaging
  • Experience with 3D CAD (preferably Siemens NX)
  • An understanding of various mechanical fabrication processes (machining, die casting, plastic molding, sheet metal) and engineering materials.
  • Experience/interest with mechanical thermal and stress FEA analysis tools
  • A self-starter with the ability to generate new ideas, navigate a dynamic environment and deliver results
  • Strong foundation of engineering fundamentals
  • Excellent written and verbal skills and ability to work across multiple disciplines
  • Candidates who wish to be considered must be enrolled in a accredited college/university as of September 2027. Applicants who have graduated before September 2027 will not be considered unless they are starting a MS or PHD program after graduating.
  • Visa Sponsorship is not available for this position. Candidates who now or at any point in the future require sponsorship for employment visa status (e.g., H-1B Visa status) may not be considered.

Responsibilities

  • Develop thermal and mechanical models to solve challenging electronics packaging issues.
  • Work within a multi-discipline project team to investigate and evaluate new electronics packaging technologies
  • Document new designs and assemblies
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