Mechanical Engineer III

Foxconn-PCE TechnologySanta Clara, CA

About The Position

The Mechanical Engineer II is responsible for defining and supporting system‑level mechanical design and architecture for server systems and rack assemblies. The role involves close collaboration with cross‑functional teams and international engineering partners to integrate designs, mitigate  mechanical risks, and ensure manufacturing readiness from NPI through mass production. Responsibilities also include production support, system risk  assessment, and mechanical failure analysis to maintain reliability and scalability across global production.

Requirements

  • Over 5 years of experience.
  • 3–5+ years in Server chassis layout and component/module design.
  • Expert in stamping, plastic injection, and tooling design.
  • Highly proficient in PTC Creo (Pro/E) for 3D modeling.
  • Strong background in mechanical testing and structured failure analysis.
  • Deep knowledge of manufacturing processes and standardized design definitions.
  • Ability to apply statistical analysis, such as tolerance stack-up, to optimize designs.
  • Proven experience collaborating with Taiwan-based R&D teams.

Nice To Haves

  • Bilingual language skills in Chinese and English is a plus but not required.

Responsibilities

  • Contribute to the structural design of server systems and rack assemblies.
  • Collaborate with cross-functional teams (Electrical, Thermal, Power) to implement structural improvements.
  • Coordinate with Taiwan engineering teams to synchronize design standards and optimize mechanical architecture for global production.
  • Support design for manufacturability reviews and resolve production-related issues during the pre-production and new product introduction phases.
  • Provide real-time troubleshooting for mechanical issues during mass production.
  • Lead or support system-level mechanical architecture definition for L5-L11 systems.
  • Identify system-level mechanical risks early in development.
  • Support mechanical failure analysis, root cause investigation, and corrective action implementation for design validation and field-related issues.
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