Mechanical Design Engineer – Semiconductor Packaging

Intel Corporation•Chandler, AZ

3d•$105,650 - $149,150•Onsite

About The Position

Intel is seeking a proactive and detail-oriented Mechanical Design Engineer to serve as a key point of contact for all collateral design activities supporting semiconductor packaging architecture. This individual will play a critical role in designing and developing mechanical components and tooling required throughout the packaging and assembly lifecycle. The ideal candidate is a strong communicator with excellent time and project management skills, capable of working cross-functionally and solving complex design problems with minimal supervision.

Requirements

US Citizenship required.
Ability to obtain and maintain a US Government TS/SCI Security Clearance with Polygraph.
Bachelor's degree in mechanical engineering or in a STEM related field of study.
1+ years' experience with CAD tools such as SolidWorks, Siemens NX, and AutoCAD or similar 2D and 3D CAD software.

Nice To Haves

Master's degree in mechanical engineering or in a STEM related field of study.
Solid mechanical design foundation and 3D spatial awareness.
Excellent communication and interpersonal skills for effective cross-functional collaboration.
Ability to interpret and generate technical drawings and specifications.

Responsibilities

Design Tape and Reel packaging for semiconductor die shipments from Fab to Assembly.
Develop and maintain mechanical designs and detailed drawings for: Substrates, Integrated Heat Spreaders (IHS), Stiffeners, Overall package assemblies.
Design process media trays used during various stages of the assembly process.
Collaborate closely with architecture, process, and assembly teams to ensure design intent and manufacturability.
Act as the single point of contact for all packaging mechanical design collateral needs.
Proactively identify and solve design and process issues, ensuring timely project execution.