Manufacturing Technician - Wire Bonding (Manual Wedge)
About The Position
Microchip company, Discrete and Integrated Solutions Group (DISG) offers one of the industry's most comprehensive power and RF/microwave discrete semiconductor product portfolios. The DISG encompasses two business units, the Power Discrete & Modules BU and the RF/Microwave Discreet BU. Markets the PDM & RF/MW discrete BU's address include: alternative energy, industrial, medical, defense, commercial aviation, communications, embedded systems, motor control, power solutions, sensors and security. Microchip is planning to fill the following position with a talented, creative and motivated individual. We are seeking a detail-oriented and technically skilled Manufacturing Technician to join our Discrete Products Group (DPG) component manufacturing department. The ideal candidate will have experience in automatic or manual aluminum wire bonding techniques and semiconductor manufacturing processes.
Requirements
- High school diploma or equivalent; technical degree or certification in electronics, microelectronics, or a related field is preferred.
- Minimum of 2 years of experience in a wire bonding or semiconductor manufacturing role.
- Proficiency with automated wire bonding machinery and manual wire bonding techniques.
- Strong understanding of microelectronics and the ability to work with delicate components.
- Ability to read and interpret technical drawings and process specifications.
- Ability to navigate and utilize a computer to perform job activities.
- Excellent manual dexterity and hand-eye coordination
- Excellent visual capability to work with extremely small die, without magnification devices.
- Experience using tweezers, vacuum pencils, etc.
- Strong problem-solving skills and attention to detail.
- Ability to work in a fast-paced, team-oriented environment.
- Good communication skills, both written and verbal.
- Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3).
Responsibilities
- Operate wire bonding machines and equipment with precision and according to standard operating procedures.
- Perform manual wire bonding tasks as needed, utilizing microscopes and bonding tools.
- Inspect and test wire bonds to ensure quality and compliance with specifications.
- Perform wire bond equipment setup including tool changes, wire changes, and troubleshoot wire bond equipment and process issues, implementing corrective actions to minimize downtime.
- Maintain accurate records of production data, process adjustments, and equipment maintenance.
- Collaborate with engineering and quality assurance teams to improve wire bonding processes and product quality.
- Adhere to cleanroom protocols and safety guidelines to maintain a safe and efficient work environment.
- Participate in continuous improvement initiatives and training programs to enhance technical skills and knowledge.
- Assist in the training of new technicians and support staff as required.
- Perform other tasks and assist with various projects as needed.
Benefits
- health benefits that begin day one
- retirement savings plans
- industry leading ESPP program with a 2 year look back feature
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
Education Level
High school or GED
