Manufacturing Process Engineer II - IRP

PHOTRONICS INC•Boise, ID

8d•Onsite

About The Position

For more than 50 years, Photronics has been a global leader in photomask technology, powering the innovation behind smartphones, computers, TVs, and other devices people use every day. Our success is built on quality, collaboration, and the dedication of our people. Join us and be part of a company recognized worldwide for cutting-edge technology, exceptional service, and strong customer partnerships. As the IRP (Inspection, Repair, and Printability) Repair Engineer, you’ll play a critical role in ensuring the quality and performance of photomasks used in advanced semiconductor manufacturing. This position spans defect inspection, precision repair (e-beam and AFM), and final printability validation to drive yield and product performance. This role is responsible for end-to-end quality assurance of photomasks and reticles used in advanced semiconductor manufacturing - from incoming defect inspection and classification, through precision repair using electron-beam (e-beam) etch techniques and atomic force microscope (AFM) nanomachining, to final printability verification and yield impact assessment. The IRP Engineer owns inspection, repair, and printability capability for assigned IRP toolsets, including long-term health, stability, and continuous improvement, and define and maintain process windows, control plans, and BKMs for IRP inspection and repair equipment, proactively identifying risks to capability or throughput. The IRP Engineer works in a cleanroom environment and collaborates closely with process integration, equipment, and lithography engineering teams to sustain and improve photomask quality, cycle time, and overall fab yield. This position requires a deep understanding of photolithography processes, mask defect physics, and related fabrication tools and equipment, combined with precision hands-on repair skills and strong data analytics capabilities.

Requirements

Experience with photomask, reticle, or semiconductor inspection/repair processes, or similar precision manufacturing environments; understanding of defect types and quality impact is preferred.
Working knowledge of semiconductor manufacturing or photolithography processes (e.g., track, exposure, or related systems) or equivalent experience in microfabrication or advanced manufacturing.
Strong technical documentation skills with the ability to create clear procedures, reports, and work instructions.
Ability to analyze process performance and trends using data; familiarity with SPC or similar methodologies is a plus.
Experience with data analysis tools (e.g., Excel, JMP, Minitab, or similar) to support problem solving and process improvement.
Familiarity with cleanroom environments or other highly controlled manufacturing settings.
Flexibility to support manufacturing operations as needed, including off-hours or weekend coverage.
3-5 years of hands-on experience in semiconductor manufacturing, photolithography, photomask engineering or photo repair roles, preferred. Relevant industry experience, considered.
Bachelor’s degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering, Optics, or related field
A combination of relevant education and experience will be considered.

Responsibilities

Perform incoming and in-process inspection of photomasks and reticles using optical inspection systems
Classify defect types (intrusions, points defects, particles, phase errors) and assess severity and printability risk using scanning electron microscopy, and aerial image simulation tools
Conduct reticle qualification, check node-specific specifications for defectivity and pattern fidelity requirements to determine ready for wafer exposure
Develop, qualify and sustain photomask defect repair capabilities using e-beam etch, and/or AFM nanomachining repair platforms to address opaque and clear defect modes across chrome-on-glass, phase-shift and EUV mask types
Characterizes repair process windows and recipe sensitivities as a function of defect geometry, height, transmission and local pattern context; optimize repair strategies to minimize collateral damage and printability risk
Perform post-repair inspection and verification to confirm defect removal effectiveness, pattern fidelity, and repair repeatability, feeding results back into capability improvement
Document and maintain repair learnings, qualified recipes, and known limitations to support consistent execution, training, and continuous improvement
Conduct printability analysis using AIMS (Aerial Image Measurement System) to measure wafer impact from reticle defects before and after repair
Collaborate with photolithography and process engineers to determine disposition of defects: repair, use-as-is, or scrap
Support mask qualification for new technology nodes and production processes, including review of critical dimension (CD) and overlay performance data
Use SPC, FMEA, and DOE outputs to make independent engineering decisions regarding process stability, defect disposition, and repair strategy
Partner with process engineering on failure analysis investigations, implementing corrective actions to reduce defect density and mask cycle time
Lead process changes from concept through qualification and production release, ensuring stakeholder alignment, risk mitigation, and documentation updates
Author and maintain standard operating procedures (SOP), work instructions, and qualification protocols for inspection, repair, and printability workflows
Develop and deliver training materials and hands-on instruction for technicians and junior engineers on inspection, repair, and printability best-known methods
Interface with photomask suppliers, OEM technical support teams, and internal process/integration engineers to resolve escalated quality issues
Participate in cross-functional design-for-manufacturability (DFM) reviews, new product introductions (NPI), and technology transfer activities