Join Intel's Advanced Packaging Technology Development - Substrate and Wafer Assembly (ATPD: SWA) team and help us fulfill our mission to be the supplier of choice for leading-edge, cost-effective substrate packaging. As a Manufacturing Equipment Technician, you will support critical manufacturing equipment and drive continuous improvement in a highly technical, cleanroom production environment. Manufacturing Equipment Technicians in Advanced Packaging Technology Development: Substrate and Wafer Assembly are responsible for: Performing electrical and/or mechanical troubleshooting to diagnose issues with non-functioning electromechanical equipment used in semiconductor manufacturing. Dismantling, adjusting, repairing, and assembling equipment according to layout plans, blueprints, operating or repair manuals, rough sketches, or engineering drawings. Performing setup, calibration, and preventive maintenance on production equipment, with a focus on wet chemistry, plating, and dry high-vacuum toolsets. Documenting maintenance activities, repairs, parts usage, and findings in accordance with established procedures and systems. Collaborating with engineering, process, and support teams to improve tool performance, reduce equipment downtime, and enhance process capability and reliability. Leading or contributing to continuous improvement projects, including root cause analysis, yield and uptime improvement initiatives, and optimization of maintenance practices. Assignments are semi-routine in nature and performed within generally defined parameters. Employees normally receive general instructions on most work and are expected to exercise judgment in resolving nonstandard problems.
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Job Type
Full-time
Career Level
Entry Level
Education Level
Associate degree