Principal Manufacturing Engineer/SR Principal Manufacturing Engineer (Weekend Shift)

Northrop Grumman•Salt Lake City, UT

1d•$89,400 - $167,500•Onsite

About The Position

Northrop Grumman Mission Systems (NGMS) is looking for a Principal Manufacturing Engineer or SR Principal Manufacturing Engineer to join the Advanced Electronics and Avionics Manufacturing Engineering Team. The selected candidates will work a shift that includes Saturday and Sunday, with flexibility in scheduling (e.g., Thursday - Sunday, Friday - Monday, Saturday - Tuesday on a 4x10 schedule, or a 9/80 schedule). The role involves developing and maintaining technical solutions for the manufacturing of circuit card assemblies, interacting with customers and manufacturing leadership for metrics reporting and issue resolution. This position may be filled at the Principal Manufacturing Engineer (level 3) or Senior Principal Manufacturing Engineer (level 4) level depending on candidate experience.

Requirements

Ability to work in a production environment.
Good technical writing skills.
Bachelor's Degree in STEM field with a minimum of 5 years of relevant work experience, Master's Degree in STEM field with 3 years of relevant work experience, or a PhD in STEM field with a minimum of 1 year(s) of relevant work experience (for Principal level).
Experience in a production manufacturing environment.
Experience with the design or build of electronic assemblies (i.e. printed circuit assembly or circuit card assembly).
Ability to work on Saturday and Sunday.
US Citizenship required.
Ability to obtain/maintain DOD Secret security clearance.
Bachelor's Degree in STEM field with a minimum of 8 years of relevant work experience, Master's Degree in STEM field with 6 years of relevant work experience, or a PhD in STEM field with a minimum of 4 years of relevant work experience (for Senior Principal level).

Nice To Haves

Experience using Product Lifecycle Management (PLM) tools.
Experience with industry standards for the build and inspection of electronic assemblies including J-STD-001 and IPC-A-610.
Experience in a manufacturing environment for circuit card assemblies.
Experience with the processes and equipment used to build circuit card assemblies.
Experience using Siemens Teamcenter as a Product Lifecycle Management (PLM) tool.
Experience using SAP as an Enterprise Resource Planning (ERP) tool.
Experience working hands-on with electronic parts and assemblies in a production environment.
Experience working with engineering drawings and parts lists using a Configuration Management (CM) system.
Experience with automated optical inspection or other machine vision systems.
Experience with data structures and network architecture.
Experience using Lean Six Sigma techniques for continuous improvement activities.
Data analysis experience.
Active Secret clearance.

Responsibilities

Work as a process owner for the manufacturing of circuit card assemblies.
Develop processes, procedures, and assembly instructions for the build of circuit card assemblies.
Perform continuous improvement activities focused on cost/schedule savings during manufacturing.
Work with customers to provide manufacturing feedback, metrics and data reporting, and issue resolution.
Perform root cause and corrective action plans using techniques such as 5 whys, fishbone diagrams, etc.
Work directly with operators and other manufacturing engineers on the shop floor in a production environment.
Work with various electronics manufacturing equipment and processes to maintain production flow.
Provide technical project leadership for continuous improvement and root cause/corrective action projects.