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Northrop Grumman•Salt Lake City, UT

5d•$72,100 - $134,200•Onsite

About The Position

Northrop Grumman Mission Systems (NGMS) is looking for a Manufacturing Engineer to join the Advanced Electronics and Avionics Manufacturing Engineering Team at their Salt Lake City, UT campus. The role involves developing and maintaining technical solutions for the manufacturing of circuit card assemblies and program inspection of circuit card assemblies using an automated optical inspection/automated x-ray inspection machine. The position also requires interaction with customers and manufacturing leadership for metrics reporting and issue resolution. This position may be filled at the Manufacturing Engineer (level 2) or Principal Manufacturing Engineer (level 3) level depending on candidate experience.

Requirements

Ability to work in a production environment.
Good technical writing skills.
Bachelor's Degree in a related STEM field with a minimum of 2 years of relevant work experience, a Master's Degree with 0 years of relevant work experience, or a PhD with 0 years of relevant work experience (for Manufacturing Engineer Level 2).
Bachelor's Degree in a related STEM field with a minimum of 5 years of relevant work experience, Master's Degree with 3 of more years of relevant work experience, or a PhD with a minimum of 1 year(s) of relevant work experience (for Principal Manufacturing Engineer Level 3).
Experience in a production manufacturing environment.
Ability to obtain/maintain DOD Secret security clearance.
US Citizenship required.

Nice To Haves

Experience with the design or build of circuit card assemblies.
Experience using Product Lifecycle Management (PLM) tools.
Experience with automated optical inspection or other machine vision systems.
Experience with data structures and network architecture.
Experience with industry standards for the build and inspection of electronic assemblies including J-STD-001 and IPC-A-610.
Experience in a manufacturing environment for circuit card assemblies.
Experience with the processes and equipment used to build circuit card assemblies.
Experience using Siemens Teamcenter as a Product Lifecycle Management (PLM) tool.
Experience using SAP as an Enterprise Resource Planning (ERP) tool.
Experience working hands-on with electronic parts and assemblies in a production environment.
Experience working with engineering drawings and parts lists using a Configuration Management (CM) system.
Experience using Lean Six Sigma techniques for continuous improvement activities.
Data analysis experience.
Active Secret clearance.

Responsibilities

Develop, update, and maintain programming of an automated optical inspection/automated x-ray inspection machine for the inspection of circuit card assemblies.
Perform data analysis of automated optical inspection/automated x-ray inspection machine results for metrics reporting and issue resolution.
Maintain organization of automated optical inspection/automated x-ray inspection programming databases and algorithm libraries.
Incorporate the build and inspection requirements of industry standards into automated optical inspection/automated x-ray inspection programs.
Work as a process owner for the manufacturing of circuit card assemblies.
Develop processes, procedures, and assembly instructions for the build of circuit card assemblies.
Perform continuous improvement activities focused on cost/schedule savings during manufacturing.
Work with customers to provide manufacturing feedback, metrics and data reporting, and issue resolution.
Perform root cause and corrective action plans using techniques such as 5 whys, fishbone diagrams, etc.
Work directly with operators and other manufacturing engineers on the shop floor in a production environment.
Work with various electronics manufacturing equipment and processes to maintain production flow.
Provide technical project leadership for continuous improvement and root cause/corrective action projects.