Manager, Failure Analysis

Ayar LabsSan Jose, CA
Onsite

About The Position

Ayar Labs is shattering AI data bottlenecks by moving data at the speed of light. As pioneers of co-packaged optics (CPO), we are using light instead of electricity to move data faster, further, and with a fraction of the energy needed to fuel the explosive growth of AI models. Backed by industry giants like NVIDIA, AMD and Intel and manufactured in partnership with the world’s leading semiconductor ecosystem, Ayar Labs’ co-packaged optics solution is key to unleashing next-generation AI scale-up architectures. We're looking for a Failure Analysis (FA) Manager to lead our FA engineering function at the intersection of two demanding technical domains: silicon photonics (SiPh) devices and deep sub-micron integrated circuits. This is a hands-on leadership role — you'll manage an internal team and lab, while also directing a global network of third-party FA labs and specialized vendors to extend our capability beyond what we run in-house. You'll report to the Head of Quality & Reliability, lead a Small team of FA engineers and partner closely with Design, Foundry, Packaging, and Reliability teams to drive root-cause analysis that shortens time-to-market and strengthens product reliability.

Requirements

  • Proven track record managing external FA vendors, commercial labs, and OSAT/foundry FA services
  • Strong program management skills: SOWs, OpEx budgets, service contracts, and timeline management
  • Experience orchestrating multi-site FA flows involving sensitive sample shipment and tracking
  • Solid understanding of integrated optical components: waveguides, modulators, photodetectors, optical couplers
  • Experience with electro-optical failure isolation techniques
  • Familiarity with optical coupling, fiber alignment, and CPO-specific failure modes
  • Experience with advanced semiconductor nodes (FinFET, GAA, or sub-7nm planar)
  • Working knowledge of electrical fault isolation techniques: EMMI, OBIRCH, TIVA, nanoprobing
  • Experience with destructive physical analysis: FIB circuit modification/cross-sectioning, SEM, TEM, EDX/EELS
  • B.S. in Electrical Engineering, Physics, Materials Science, or related field
  • 8+ years in semiconductor failure analysis, including 3+ years in management, technical leadership, or vendor-facing program management
  • Solid grounding in semiconductor reliability physics and wafer fabrication processes

Nice To Haves

  • Direct experience with optical-domain FA tools: OTDR, optical spectrum analyzer, IR/thermal imaging, laser voltage probing (LVP/LADA)
  • Experience building or scaling an FA function in a startup or fast-growth environment
  • Familiarity with export control compliance (ITAR/EAR) for hardware sample handling
  • M.S. or Ph.D. in a relevant technical field

Responsibilities

  • Lead, mentor, and grow a team of FA engineers and technicians
  • Own capital expenditure (CapEx) planning and internal lab equipment roadmap
  • Set team priorities and workload balance across internal case volume
  • Qualify, onboard, and manage relationships with external FA service providers, commercial labs, and specialized tool vendors
  • Define and negotiate Statement of Work (SOW) agreements, including pricing, SLAs, and target cycle times
  • Direct and track external FA workflows, ensuring high-quality, actionable data and timely report delivery
  • Build and manage a hybrid internal/external model that routes advanced or niche techniques to the right partner
  • Oversee secure, compliant handling and shipment of sensitive, high-value samples across internal and external sites, including chain-of-custody and export control (ITAR/EAR) considerations
  • Define FA methodology and technology roadmap for next-generation products, spanning deep sub-micron silicon (logic/analog) and novel optical device isolation techniques
  • Evaluate and introduce new tools/techniques as SiPh and CPO architectures evolve
  • Guide the team and external partners through end-to-end failure isolation and physical analysis on SiPh chips, co-packaged optics (CPO), and advanced-node silicon
  • Review and validate technical findings before they go to internal stakeholders or customers
  • Ensure timely, high-quality FA reports for internal and customer-facing use
  • Establish and track KPIs across internal and external work, e.g.: Mean time-to-root-cause by failure category, First-pass root-cause success rate, Vendor SLA adherence and cycle-time trends, Lab throughput vs. capacity
  • Present findings and program status to engineering and executive stakeholders

Benefits

  • Annual Salary Range: $180,000 - $210,000
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