GlobalFoundries Fab9 is seeking a highly skilled and motivated R&D assembly engineer to become part of our Quantum Advanced Packaging team. This role will entail enabling next-generation assembly scaling development efforts in our Advanced Packaging and Photonics Center (APPC) as well as with our partners. The primary responsibility of this position is to develop low-temperature bonding processes, support advanced die assembly technologies, and associated assembly equipment. The engineer will drive process characterization, tool optimization, defect reduction, and integration activities required to support next-generation superconducting and cryogenic quantum packaging platforms.
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Job Type
Full-time
Career Level
Entry Level