Leader, Hardware Engineering

Cisco•San Jose, CA

2d•$194,600 - $285,700•Onsite

About The Position

You will join the Component Quality & Technology Group within Global Supply Chain Operations. Our team is at the forefront of technical innovation, responsible for the roadmap, development, and implementation of sophisticated end-to-end thermal solutions that power Cisco's world-class products. You will collaborate extensively with Business Units, Product Operations, Manufacturing, Planning, and Supplier Management. You will also represent Cisco in external industry forums, conferences, and academic partnerships to adopt cutting-edge technologies that keep Cisco ahead of the competition.

Requirements

BS in Mechanical, Thermal, or Chemical Engineering or a related field.
10+ years of experience in the design, simulation, testing of thermal solutions for electronic devices and systems.
Extensive experience with advanced air-cooling technologies (vapor chambers, remote heat sinks, TIM, fan trays).
Experience with liquid cooling and/or immersion cooling.
Proven people leadership experience.

Nice To Haves

MS or PhD in Mechanical or Chemical Engineering or a related field.
15+ years of relevant experience in microelectronics thermal cooling; 10+ years of people leadership experience.
Expertise in Thermal Interface Material (TIM) conductivity testing procedures and microelectronics manufacturing processes.

Responsibilities

Lead a global team of thermal component engineers, fostering a culture of technical excellence, mentorship, and career development.
Partner with microelectronics packaging suppliers, thermal interface material (TIM) vendors, and internal stakeholders to define and execute a system-wide thermal technology roadmap.
Drive supply ecosystem readiness for advanced cooling technologies, including liquid and immersion cooling.
Investigate innovative, large-scale thermal cooling solutions.
Develop commodity and supplier strategies based on industry sensing, quality roadmaps, and rigorous supplier assessments.
Establish and maintain an end-to-end quality strategy for all thermal components.
Analyze thermal performance tradeoffs (substrate, underfill, TIM, heat spreaders) and chip thermal gradients using experimental test data.
Define test plans and qualification requirements for mechanical and manufacturing adaptability (pumps, heat pipes, vapor chambers, heat sinks, liquid cooling).
Engage with ODMs and component vendors, participate in industry consortia, and collaborate with academia to influence Cisco's position as an industry leader.