Lead Process Engineer – SiC/GaN Power Modules

GE Aerospace•Pompano Beach, FL

3d•Onsite

About The Position

The Lead Process Engineer will play a critical role in the development, optimization, and scaling of manufacturing processes for SiC/GaN power modules. This position partners closely with design engineering, operations, quality, and supply chain teams to lead rapid prototyping, improve process capability, increase manufacturing efficiency, reduce waste, and support the successful transition of products from development into production. This role is highly hands-on and requires deep experience in cleanroom-based electronics manufacturing, power module assembly, test methods, and lean process improvement. The ideal candidate is a strong technical leader who can identify process gaps, solve complex manufacturing problems, drive measurable improvements in safety, quality, delivery, and cost, and collaborate across functions to build robust, scalable processes that meet customer and business requirements.

Requirements

Bachelor’s or Master’s degree in Engineering or a related technical field
Minimum of 2 years of electronics manufacturing or process engineering experience in a cleanroom environment
Experience troubleshooting manufacturing, assembly, or process issues in a cleanroom environment
Demonstrated experience driving process improvement, waste reduction, yield improvement, or cycle time reduction
Working knowledge of equipment such as die bonders, wire bonders, stencil printers, soldering/reflow systems, and related assembly tools
Experience with electronic test, inspection, and troubleshooting techniques to the component level
Understanding of materials used in power module or electronics assembly, including: varieties of solder preforms and solder paste, conductive and non-conductive adhesives, conductors and dielectrics, varieties of silicone potting materials
Familiarity with cleanroom operating protocols and maintenance requirements
Knowledge of lean manufacturing principles, standard work, root cause problem solving, and continuous improvement methods
Ability to work in a cleanroom environment for extended periods of time while wearing required cleanroom attire

Nice To Haves

Experience with SiC and/or GaN power modules
Experience in power electronics packaging, semiconductor assembly, or advanced electronics manufacturing
Experience supporting prototype builds, new product introduction (NPI), production ramp, or production transition
Background in failure analysis, process characterization, qualification testing, or manufacturing yield improvement
Experience programming or optimizing automated assembly equipment
Demonstrated ability to lead technical work, influence cross-functional teams, and drive measurable process improvements
Experience applying lean tools such as root cause analysis, standard work, visual management, process flow improvement, or defect reduction methods

Responsibilities

Lead SiC/GaN power module prototyping, assembly, and test activities in a cleanroom manufacturing environment, with a strong focus on process repeatability and production readiness
Drive process development, process optimization, and continuous improvement initiatives to improve yield, throughput, cycle time, quality, and manufacturability
Identify process bottlenecks, variation drivers, and waste across manufacturing flows, and implement corrective and preventive actions
Apply lean manufacturing principles and problem-solving methods to improve safety, quality, delivery, and cost performance
Lead root cause investigations on product and process issues and implement sustainable corrective actions to prevent recurrence
Troubleshoot existing SiC power module products and manufacturing processes, identify failure mechanisms, and improve process capability
Evaluate new materials, process parameters, tooling, and manufacturing methods to improve product performance, reliability, and ease of manufacture
Support qualification activities for power semiconductors, materials, assembly processes, and test methods
Develop, refine, and standardize manufacturing methods to support consistent execution from prototype through production transition
Perform and interpret acceptance testing, including pass/fail analysis, trend review, and out-of-range condition assessment
Conduct failure analysis on defective components and assemblies using destructive and non-destructive techniques to drive process learning and corrective action
Operate and support process equipment such as die bonders, wire bonders, stencil printers, reflow/soldering systems, plasma cleaners, and ovens
Program and optimize automated assembly tools, including bonders, dispensers, and pick-and-place systems, to improve consistency, repeatability, and efficiency
Use advanced test and inspection equipment such as acoustic microscopy (CSAM), electrical curve tracers, pull-shear testers, and other characterization tools to assess product and process performance
Measure and analyze components and assemblies to identify variation, failure mechanisms, and opportunities to improve process robustness
Maintain and improve bills of materials (BOMs), process travelers, reference documents, work instructions, and test/process instructions to ensure clear standard work and manufacturing discipline
Establish and sustain process documentation that supports training, repeatability, traceability, and production control
Communicate technical status, process risks, improvement opportunities, and recommendations clearly to management and cross-functional stakeholders
Train, mentor, and support technicians and assemblers to ensure safe, standardized, high-quality, and on-time execution
Partner with sustaining, electrical, quality, manufacturing, and supply chain teams to ensure products meet customer requirements, derived technical requirements, and manufacturing readiness expectations
Champion a culture of lean manufacturing, standard work, visual management, and continuous improvement across module development and assembly activities