Lead Principal Engineer Analog Design

Infineon•Morrisville, NC
•$192,200 - $264,300•Onsite

About The Position

As a Lead Principal Engineer Analog Design on our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life.

Requirements

  • BS, MS, or PhD in Electrical Engineering or Physics
  • 5 years in technical leadership positions
  • Significant experience in DC-DC control and Power IC development
  • Methodical, data-driven problem solving
  • Clear, concise communications and collaborative partner who proactively syncs with coworkers
  • Curious and fast learner, Innovative mindset
  • Customer/impact oriented

Responsibilities

  • Lead a small team of IC Design Engineers and develop talented individuals for technical and career growth
  • Design/verify DC-DC control loops; compensation, transient response, EMI/EMC, efficiency optimization
  • High voltage device handling (BCD processes), gate drivers, synchronous rectification, current sensing
  • SPICE simulations (DC/AC/transient/noise), stability/Bode analysis for control loops, PSRR/CMRR
  • PVT corners and Monte Carlo (mismatch/yield) with sensitivity analysis; parasitic-aware sims post layout
  • Behavioral modeling (Verilog A/MATLAB) for speed and architecture exploration; back annotation and correlation. Layout collaboration and physical verification
  • Interpret DRC, LVS, PEX; assist with floor-planning, device sizing, resistor/cap selection; basic EM/IR checks
  • Incorporate ESD/latch up constraints and reliability rules for the target process (often CMOS/BCD for power)
  • Integrate blocks into chip/top level: biasing, references, I/O paring/ESD, power domains, startup/reset sequencing
  • Support ATE/test engineering with characterization vectors and limit setting; contribute to yield/ramp investigations.
  • Work with Systems/Applications to translate requirements to circuit specs; with Reliability/Quality on stress/aging (BTI/HCI/EM)considerations; with Packaging on parasitic/thermal; with Test/Production, DfT and test time; with Technology Development on Si process improvements

Benefits

  • Incentive plan
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